Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6736701 | Eliminate broken line damage of copper after CMP | Shau-Lin Shue, Ying-Ho Chen, Tsu Shih, Syun-Ming Jang | 2004-05-18 |
| 6727172 | Process to reduce chemical mechanical polishing damage of narrow copper lines | Shwangming Jong, Syun-Ming Jang | 2004-04-27 |