Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6806192 | Method of barrier-less integration with copper alloy | Jing-Cheng Lin, Cheng-Lin Huang, Shau-Lin Shue, Mong-Song Liang | 2004-10-19 |
| 6800558 | Photoresist scum for copper dual damascene process | Chung-Liang Chang | 2004-10-05 |
| 6797144 | Method for reducing surface defects in an electrodeposition process | Hung-Wen Su, Shih-Wei Chou, Shau-Lin Shue | 2004-09-28 |