Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6811670 | Method for forming cathode contact areas for an electroplating process | Chen-Hua Yu | 2004-11-02 |
| 6753259 | Method of improving the bondability between Au wires and Cu bonding pads | Syun-Ming Jang, Mong-Song Liang, Chen-Hua Yu, Jane-Bai Lai | 2004-06-22 |
| 6737352 | Method of preventing particle generation in plasma cleaning | Shau-Lin Shue, Chen-Hua Ya | 2004-05-18 |
| 6734110 | Damascene method employing composite etch stop layer | Syun-Ming Jang, Chen-Hua Yu | 2004-05-11 |
| 6734053 | Effective MIM fabrication method and apparatus to avoid breakdown and leakage on damascene copper process | Chen-Hua Yu | 2004-05-11 |
| 6723639 | Prevention of post CMP defects in Cu/FSG process | Shau-Lin Shue | 2004-04-20 |
| 6703286 | Metal bond pad for low-k inter metal dielectric | Chen-Hua Yu | 2004-03-09 |