Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6784119 | Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition | Li-Qun Xia, Tian-Hoe Lim, Ellie Yieh, Wai-Fan Yau, Shin-Puu Jeng +2 more | 2004-08-31 |
| 6753258 | Integration scheme for dual damascene structure | Li-Qun Xia, Ellie Yieh, Paul Fisher, Margaret Gotuaco | 2004-06-22 |
| 6753270 | Process for depositing a porous, low dielectric constant silicon oxide film | Fabrice Geiger | 2004-06-22 |
| 6750141 | Silicon carbide cap layers for low dielectric constant silicon oxide layers | Li-Qun Xia, Paul Fisher, Margaret Gotuaco, Ellie Yieh | 2004-06-15 |
| 6733955 | Methods for forming self-planarized dielectric layer for shallow trench isolation | Fabrice Geiger | 2004-05-11 |
| 6703321 | Low thermal budget solution for PMD application using sacvd layer | Fabrice Geiger | 2004-03-09 |