Issued Patents 2004
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6806207 | Method of depositing low K films | Tzu-Fang Huang, Yung-Cheng Lu, Li-Qun Xia, Ellie Yieh, David Cheung +5 more | 2004-10-19 |
| 6800571 | CVD plasma assisted low dielectric constant films | David Cheung, Robert R. Mandal | 2004-10-05 |
| 6784107 | Method for planarizing a copper interconnect structure | Hui Chen, Chun YAN | 2004-08-31 |
| 6784119 | Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition | Frederic Gaillard, Li-Qun Xia, Tian-Hoe Lim, Ellie Yieh, Shin-Puu Jeng +2 more | 2004-08-31 |
| 6770556 | Method of depositing a low dielectric with organo silane | David Cheung, Shin-Puu Jeng, Kuowei Liu, Yung-Cheng Yu | 2004-08-03 |
| 6743737 | Method of improving moisture resistance of low dielectric constant films | David Cheung, Nasreen Chopra, Yung-Cheng Lu, Robert P. Mandal, Farhad Moghadam | 2004-06-01 |
| 6734115 | Plasma processes for depositing low dielectric constant films | David Cheung, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2004-05-11 |
| 6730593 | Method of depositing a low K dielectric with organo silane | David Cheung, Shin-Puu Jeng, Kuowei Liu, Yung-Cheng Yu | 2004-05-04 |