Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6784119 | Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition | Frederic Gaillard, Li-Qun Xia, Tian-Hoe Lim, Ellie Yieh, Wai-Fan Yau +2 more | 2004-08-31 |
| 6777318 | Aluminum/copper clad interconnect layer for VLSI applications | Shang-Yun Hou | 2004-08-17 |
| 6770556 | Method of depositing a low dielectric with organo silane | Wai-Fan Yau, David Cheung, Kuowei Liu, Yung-Cheng Yu | 2004-08-03 |
| 6753210 | Metal fuse for semiconductor devices | Chi-Hsi Wu, Shang-Yun Hou | 2004-06-22 |
| 6734115 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2004-05-11 |
| 6730593 | Method of depositing a low K dielectric with organo silane | Wai-Fan Yau, David Cheung, Kuowei Liu, Yung-Cheng Yu | 2004-05-04 |
| 6709715 | Plasma enhanced chemical vapor deposition of copolymer of parylene N and comonomers with various double bonds | Chi-I Lang, Yeming Jim Ma, Fong Chang, Peter Wai-Man Lee, David Cheung | 2004-03-23 |