Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6777318 | Aluminum/copper clad interconnect layer for VLSI applications | Shin-Puu Jeng | 2004-08-17 |
| 6753210 | Metal fuse for semiconductor devices | Shin-Puu Jeng, Chi-Hsi Wu | 2004-06-22 |