Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831365 | Method and pattern for reducing interconnect failures | Chih-Hsiang Yao, Wen-Kai Wan, Chin-Chiu Hsia | 2004-12-14 |
| 6825541 | Bump pad design for flip chip bumping | Tze-Liang Lee | 2004-11-30 |
| 6787803 | Test patterns for measurement of low-k dielectric cracking thresholds | Chih-Hsiang Yao | 2004-09-07 |