Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6830996 | Device performance improvement by heavily doped pre-gate and post polysilicon gate clean | Chia-Lin Chen, Shih-Chang Chen | 2004-12-14 |
| 6825541 | Bump pad design for flip chip bumping | Tai-Chun Huang | 2004-11-30 |
| 6737362 | Method for manufacturing a thin gate dielectric layer for integrated circuit fabrication | Chia-Lin Chen, Chun-Lin Wu, Chi-Chun Chen, Shih-Chang Chen | 2004-05-18 |
| 6727134 | Method of forming a nitride gate dielectric layer for advanced CMOS devices | Chi-Chun Chen, Shih-Chang Chen | 2004-04-27 |