HT

Helmut Tews

Infineon Technologies Ag: 11 patents #5 of 897Top 1%
IBM: 6 patents #182 of 5,539Top 4%
📍 Poughkeepsie, NY: #1 of 210 inventorsTop 1%
🗺 New York: #29 of 9,423 inventorsTop 1%
Overall (2003): #668 of 273,478Top 1%
14
Patents 2003

Issued Patents 2003

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
6670235 Process flow for two-step collar in DRAM preparation Stephan Kudelka, Oliver Genz 2003-12-30
6656798 Gate processing method with reduced gate oxide corner and edge thinning Oleg Gluschenkov, Mary E. Weybright 2003-12-02
6620724 Low resistivity deep trench fill for DRAM and EDRAM applications Uwe Schroeder, Irene McStay, Manfred Hauf, Matthias Goldbach, Bernhard Sell +5 more 2003-09-16
6613642 Method for surface roughness enhancement in semiconductor capacitor manufacturing Stephen Rahn, Irene McStay, Uwe Schroeder, Stephan Kudelka, Rajarao Jammy 2003-09-02
6605838 Process flow for thick isolation collar with reduced length Jack A. Mandelman, Rama Divakaruni, Gerd Fehlauer, Stephan Kudelka, Uwe Schroeder 2003-08-12
6605860 Semiconductor structures and manufacturing methods Alexander Michaelis, Stephan Kudelka, Uwe Schroeder, Raj Jammy, Ulrike Gruening 2003-08-12
6599798 Method of preparing buried LOCOS collar in trench DRAMS Stephan Kudelka, Uwe Schroeder, Rolf Weis 2003-07-29
6579766 Dual gate oxide process without critical resist and without N2 implant Ravikumar Ramachandran, Kilho Lee 2003-06-17
6573137 Single sided buried strap Ramachandra Divakaruni, Jack A. Mandelman, Wolfgang Bergner, Gary B. Bronner, Ulrike Gruening +5 more 2003-06-03
6559002 Rough oxide hard mask for DT surface area enhancement for DT DRAM Stephan Kudelka, Stephen Rahn, Irene McStay, Uwe Schroeder 2003-05-06
6555430 Process flow for capacitance enhancement in a DRAM trench Michael P. Chudzik, Johnathan E. Faltermeier, Rajarao Jammy, Stephan Kudelka, Irene McStay +1 more 2003-04-29
6544855 Process flow for sacrificial collar with polysilicon void Rolf Weis, Irene McStay 2003-04-08
6537926 Process for improving the thickness uniformity of a thin oxide layer in semiconductor wafer fabrication Martin Schrems 2003-03-25
6534376 Process flow for sacrificial collar scheme with vertical nitride mask 2003-03-18