Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6620724 | Low resistivity deep trench fill for DRAM and EDRAM applications | Uwe Schroeder, Helmut Tews, Manfred Hauf, Matthias Goldbach, Bernhard Sell +5 more | 2003-09-16 |
| 6613642 | Method for surface roughness enhancement in semiconductor capacitor manufacturing | Stephen Rahn, Helmut Tews, Uwe Schroeder, Stephan Kudelka, Rajarao Jammy | 2003-09-02 |
| 6576565 | RTCVD process and reactor for improved conformality and step-coverage | Ashima B. Chakravarti, Oleg Gluschenkov | 2003-06-10 |
| 6559002 | Rough oxide hard mask for DT surface area enhancement for DT DRAM | Stephan Kudelka, Helmut Tews, Stephen Rahn, Uwe Schroeder | 2003-05-06 |
| 6555430 | Process flow for capacitance enhancement in a DRAM trench | Michael P. Chudzik, Johnathan E. Faltermeier, Rajarao Jammy, Stephan Kudelka, Kenneth T. Settlemyer, Jr. +1 more | 2003-04-29 |
| 6544855 | Process flow for sacrificial collar with polysilicon void | Helmut Tews, Rolf Weis | 2003-04-08 |
| 6528383 | Simultaneous formation of deep trench capacitor and resistor | Satya N. Chakravarti, Ashima B. Chakravarti, Kwong Hon Wong | 2003-03-04 |