Issued Patents All Time
Showing 76–100 of 159 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6338982 | Enhancements in framed sheet processing | Masud Beroz, Thomas H. DiStefano, Matthew T. Hendrickson, David Light | 2002-01-15 |
| 6333207 | Peelable lead structure and method of manufacture | David Light | 2001-12-25 |
| 6329607 | Microelectronic lead structures with dielectric layers | Joseph Fjelstad | 2001-12-11 |
| 6306752 | Connection component and method of making same | Thomas H. DiStefano, Joseph Fjeslstad | 2001-10-23 |
| 6307260 | Microelectronic assembly fabrication with terminal formation from a conductive layer | Joseph Fjelstad | 2001-10-23 |
| 6303408 | Microelectronic assemblies with composite conductive elements | — | 2001-10-16 |
| 6300231 | Method for creating a die shrink insensitive semiconductor package and component therefor | Belgacem Haba | 2001-10-09 |
| 6294040 | Transferable resilient element for packaging of a semiconductor chip and method therefor | Kurt Raab | 2001-09-25 |
| 6286205 | Method for making connections to a microelectronic device having bump leads | Anthony B. Faraci, James Zaccardi, Thomas H. DiStefano | 2001-09-11 |
| 6281588 | Lead configurations | Thomas H. Di Stefano | 2001-08-28 |
| 6274820 | Electrical connections with deformable contacts | Thomas H. DiStefano, Konstantine Karavakis, Zlata Kovac, Joseph Fjelstad | 2001-08-14 |
| 6266874 | Methods of making microelectronic components having electrophoretically deposited layers | Thomas H. DiStefano, Konstantine Karavakis, Zlata Kovac, Joseph Fjelstad | 2001-07-31 |
| 6265759 | Laterally situated stress/strain relieving lead for a semiconductor chip package | Thomas H. DiStefano, Joseph Fjelstad | 2001-07-24 |
| 6265765 | Fan-out semiconductor chip assembly | Thomas H. DiStefano, Tony Faraci | 2001-07-24 |
| 6255723 | Layered lead structures | David Light, Thomas H. DiStefano, David Rodney Baker, Hung-Ming Wang | 2001-07-03 |
| 6239384 | Microelectric lead structures with plural conductors | Joseph Fjelstad | 2001-05-29 |
| 6239386 | Electrical connections with deformable contacts | Thomas H. DiStefano, Konstantine Karavakis, Zlata Kovac, Joseph Fjelstad | 2001-05-29 |
| 6238938 | Methods of making microelectronic connections with liquid conductive elements | — | 2001-05-29 |
| 6232152 | Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures | Thomas H. DiStefano, Craig Mitchell | 2001-05-15 |
| 6228685 | Framed sheet processing | Masud Beroz, Thomas H. DiStefano | 2001-05-08 |
| 6228686 | Method of fabricating a microelectronic assembly using sheets with gaps to define lead regions | Joseph Fjelstad | 2001-05-08 |
| 6217972 | Enhancements in framed sheet processing | Masud Beroz, Thomas H. DiStefano, Matthew T. Hendrickson, David Light | 2001-04-17 |
| 6218213 | Microelectronic components with frangible lead sections | Joseph Fjelstad | 2001-04-17 |
| 6208025 | Microelectronic component with rigid interposer | Pieter H. Bellaar, Thomas H. DiStefano, Joseph Fjelstad, Christopher M. Pickett | 2001-03-27 |
| 6205660 | Method of making an electronic contact | Joseph Fjelstad, Thomas H. DiStefano, James Zaccardi, A. Christian Walton | 2001-03-27 |