Issued Patents All Time
Showing 51–75 of 159 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6635553 | Microelectronic assemblies with multiple leads | Thomas H. DiStefano | 2003-10-21 |
| 6627478 | Method of making a microelectronic assembly with multiple lead deformation using differential thermal expansion/contraction | Christopher M. Pickett | 2003-09-30 |
| 6603209 | Compliant integrated circuit package | Thomas H. DiStefano, Konstantine Karavakis, Craig Mitchell | 2003-08-05 |
| 6589819 | Microelectronic packages having an array of resilient leads and methods therefor | Bruce M. McWilliams | 2003-07-08 |
| 6586955 | Methods and structures for electronic probing arrays | Joseph Fjelstad | 2003-07-01 |
| 6570101 | Lead configurations | Thomas Di Stefano | 2003-05-27 |
| D473517 | Partition insert | Thomas Overthun, James N. Ludwig, David M. Gresham, Karl-Heinz Mueller, Monika Conway +1 more | 2003-04-22 |
| 6541852 | Framed sheets | Masud Beroz, Thomas H. DiStefano | 2003-04-01 |
| 6525429 | Methods of making microelectronic assemblies including compliant interfaces | Zlata Kovac, Craig Mitchell, Thomas H. DiStefano | 2003-02-25 |
| 6518662 | Method of assembling a semiconductor chip package | Joseph Fjelstad | 2003-02-11 |
| 6489674 | Method for creating a die shrink insensitive semiconductor package and component therefor | Belgacem Haba | 2002-12-03 |
| 6486547 | Microelectronic assembly incorporating lead regions defined by gaps in a polymeric sheet | Joseph Fjelstad | 2002-11-26 |
| 6468836 | Laterally situated stress/strain relieving lead for a semiconductor chip package | Thomas H. DiStefano, Joseph Fjelstad | 2002-10-22 |
| 6441488 | Fan-out translator for a semiconductor package | — | 2002-08-27 |
| 6437240 | Microelectronic connections with liquid conductive elements | — | 2002-08-20 |
| 6429112 | Multi-layer substrates and fabrication processes | Belgacem Haba | 2002-08-06 |
| 6420661 | Connector element for connecting microelectronic elements | Thomas H. Di Stefano | 2002-07-16 |
| 6373141 | Bondable compliant pads for packaging of a semiconductor chip and method therefor | Thomas H. DiStefano, Zlata Kovac | 2002-04-16 |
| 6370032 | Compliant microelectronic mounting device | Thomas H. DiStefano, Zlata Kovac, Konstantine Karavakis | 2002-04-09 |
| 6365436 | Connecting multiple microelectronic elements with lead deformation | Tony Faraci, Thomas H. DiStefano | 2002-04-02 |
| 6365975 | Chip with internal signal routing in external element | Thomas H. DiStefano | 2002-04-02 |
| 6361959 | Microelectronic unit forming methods and materials | Masud Beroz, Joseph Fjelstad, Belgacem Haba, Christopher M. Pickett | 2002-03-26 |
| 6358780 | Semiconductor package assemblies with moisture vents and methods of making same | Christopher M. Pickett | 2002-03-19 |
| 6357112 | Method of making connection component | Thomas H. DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis +1 more | 2002-03-19 |
| 6359335 | Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures | Thomas H. DiStefano, Craig Mitchell | 2002-03-19 |