Issued Patents All Time
Showing 101–125 of 159 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6202297 | Socket for engaging bump leads on a microelectronic device and methods therefor | Anthony B. Faraci, James Zaccardi, Thomas H. DiStefano | 2001-03-20 |
| 6204091 | Method of assembling a semiconductor chip package | Joseph Fjelstad | 2001-03-20 |
| 6202298 | Microelectronic connections with liquid conductive elements | — | 2001-03-20 |
| 6194291 | Microelectronic assemblies with multiple leads | Thomas H. DiStefano | 2001-02-27 |
| 6191368 | Flexible, releasable strip leads | Thomas H. Di Stefano | 2001-02-20 |
| 6147400 | Connecting multiple microelectronic elements with lead deformation | Tony Faraci, Thomas H. DiStefano | 2000-11-14 |
| 6133639 | Compliant interface for semiconductor chip and method therefor | Zlata Kovac, Craig Mitchell, Thomas H. DiStefano | 2000-10-17 |
| 6130116 | Method of encapsulating a microelectronic assembly utilizing a barrier | Joseph Fjelstad | 2000-10-10 |
| 6117694 | Flexible lead structures and methods of making same | Belgacem Haba | 2000-09-12 |
| 6114763 | Semiconductor package with translator for connection to an external substrate | — | 2000-09-05 |
| 6104087 | Microelectronic assemblies with multiple leads | Thomas H. DiStefano | 2000-08-15 |
| 6096574 | Methods of making microelectronic corrections with liquid conductive elements | — | 2000-08-01 |
| 6080932 | Semiconductor package assemblies with moisture vents | Christopher M. Pickett | 2000-06-27 |
| 6080603 | Fixtures and methods for lead bonding and deformation | Thomas H. DiStefano, Anthony B. Faraci | 2000-06-27 |
| 6044548 | Methods of making connections to a microelectronic unit | Thomas H. DiStefano | 2000-04-04 |
| 6030856 | Bondable compliant pads for packaging of a semiconductor chip and method therefor | Thomas H. DiStefano, Zlata Kovac | 2000-02-29 |
| 6012224 | Method of forming compliant microelectronic mounting device | Thomas H. DiStefano, Zlata Kovac, Konstantine Karavakis | 2000-01-11 |
| 6002168 | Microelectronic component with rigid interposer | Pieter H. Bellaar, Thomas H. DiStefano, Joseph Fjelstad, Christopher M. Pickett | 1999-12-14 |
| 5994781 | Semiconductor chip package with dual layer terminal and lead structure | — | 1999-11-30 |
| 5994222 | Method of making chip mountings and assemblies | Thomas H. DiStefano | 1999-11-30 |
| 5989936 | Microelectronic assembly fabrication with terminal formation from a conductive layer | Joseph Fjelstad | 1999-11-23 |
| 5980270 | Soldering with resilient contacts | Joseph Fjelstad, Thomas H. DiStefano | 1999-11-09 |
| 5959354 | Connection components with rows of lead bond sections | Thomas H. DiStefano | 1999-09-28 |
| 5934914 | Microelectronic contacts with asperities and methods of making same | Joseph Fjelstad, Thomas H. DiStefano, James Zaccardi, A. Christian Walton | 1999-08-10 |
| 5929517 | Compliant integrated circuit package and method of fabricating the same | Thomas H. DiStefano, Konstantine Karavakis, Craig Mitchell | 1999-07-27 |