Issued Patents All Time
Showing 126–150 of 159 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5913109 | Fixtures and methods for lead bonding and deformation | Thomas H. DiStefano, Anthony B. Faraci | 1999-06-15 |
| 5859472 | Curved lead configurations | Thomas H. DiStefano | 1999-01-12 |
| 5830782 | Microelectronic element bonding with deformation of leads in rows | Thomas H. DiStefano | 1998-11-03 |
| 5821609 | Semiconductor connection component with frangible lead sections | Thomas H. DiStefano, Konstantine Karavakis, Joseph Fjelstad | 1998-10-13 |
| 5821608 | Laterally situated stress/strain relieving lead for a semiconductor chip package | Thomas H. DiStefano, Joseph Fjelstad | 1998-10-13 |
| 5812378 | Microelectronic connector for engaging bump leads | Joseph Fjelstad, Thomas H. DiStefano, A. Christian Walton | 1998-09-22 |
| 5810609 | Socket for engaging bump leads on a microelectronic device and methods therefor | Anthony B. Faraci, James Zaccardi, Thomas H. DiStefano | 1998-09-22 |
| 5807453 | Fabrication of leads on semiconductor connection components | Joseph Fjelstad | 1998-09-15 |
| 5808874 | Microelectronic connections with liquid conductive elements | — | 1998-09-15 |
| 5802699 | Methods of assembling microelectronic assembly with socket for engaging bump leads | Joseph Fjelstad, Thomas H. DiStefano, A. Christian Walton | 1998-09-08 |
| 5801441 | Microelectronic mounting with multiple lead deformation and bonding | Thomas H. DiStefano | 1998-09-01 |
| 5798286 | Connecting multiple microelectronic elements with lead deformation | Tony Faraci, Thomas H. DiStefano | 1998-08-25 |
| 5794330 | Microelectronics unit mounting with multiple lead bonding | Thomas H. DiStefano | 1998-08-18 |
| 5776796 | Method of encapsulating a semiconductor package | Thomas H. DiStefano, Joseph Fjelstad, Craig Mitchell, Konstantine Karavakis | 1998-07-07 |
| 5706174 | Compliant microelectrionic mounting device | Thomas H. DiStefano, Zlata Kovac, Konstantine Karavakis | 1998-01-06 |
| 5688716 | Fan-out semiconductor chip assembly | Thomas H. DiStefano, Tony Faraci | 1997-11-18 |
| 5679194 | Fabrication of leads on semiconductor connection components | Joseph Fjelstad | 1997-10-21 |
| 5663106 | Method of encapsulating die and chip carrier | Konstantine Karavakis, Thomas H. DiStefano, Craig Mitchell | 1997-09-02 |
| 5659952 | Method of fabricating compliant interface for semiconductor chip | Zlata Kovac, Craig Mitchell, Thomas H. DiStefano | 1997-08-26 |
| 5650914 | Compliant thermal connectors, methods of making the same and assemblies incorporating the same | Thomas H. DiStefano | 1997-07-22 |
| 5632631 | Microelectronic contacts with asperities and methods of making same | Joseph Fjelstad, Thomas H. DiStefano, James Zaccardi, A. Christian Walton | 1997-05-27 |
| 5629239 | Manufacture of semiconductor connection components with frangible lead sections | Thomas H. DiStefano, Konstantine Karavakis, Joseph Fjelstad | 1997-05-13 |
| 5615824 | Soldering with resilient contacts | Joseph Fjelstad, Thomas H. DiStefano | 1997-04-01 |
| 5590460 | Method of making multilayer circuit | Thomas H. DiStefano, Konstantine Karavakis, Zlata Kovac, Joseph Fjelstad | 1997-01-07 |
| 5557501 | Compliant thermal connectors and assemblies incorporating the same | Thomas H. DiStefano | 1996-09-17 |