Issued Patents All Time
Showing 26–50 of 159 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D520355 | Insert for partition panel | Thomas Overthun, James N. Ludwig, David M. Gresham, Karl-Heinz Mueller, Monika Conway +1 more | 2006-05-09 |
| D518063 | Support arm for a display | Anthony Piazza, Steven L. Atkins, James R. Yurchenco, Jonathan Kaplan, Paul Frey +1 more | 2006-03-28 |
| 6965158 | Multi-layer substrates and fabrication processes | Belgacem Haba | 2005-11-15 |
| 6938338 | Method of making an electronic contact | Joseph Fjelstad, Thomas H. DiStefano, James Zaccardi, A. Christian Walton | 2005-09-06 |
| 6939735 | Microelectronic assembly formation with releasable leads | Mitchell Koblis | 2005-09-06 |
| 6927095 | Low cost and compliant microelectronic packages for high I/O and fine pitch | — | 2005-08-09 |
| 6921713 | Semiconductor chip package with interconnect structure | Belgacem Haba | 2005-07-26 |
| 6897090 | Method of making a compliant integrated circuit package | Thomas H. DiStefano, Konstantine Karavakis, Craig Mitchell | 2005-05-24 |
| 6891255 | Microelectronic packages having an array of resilient leads | Bruce M. McWilliams | 2005-05-10 |
| 6870272 | Methods of making microelectronic assemblies including compliant interfaces | Zlata Kovac, Craig Mitchell, Thomas H. DiStefano | 2005-03-22 |
| 6849953 | Microelectronic assemblies with composite conductive elements | — | 2005-02-01 |
| 6848173 | Microelectric packages having deformed bonded leads and methods therefor | Joseph Fjelstad, Masud Beroz, Belgacem Haba | 2005-02-01 |
| 6846700 | Method of fabricating microelectronic connections using masses of fusible material | — | 2005-01-25 |
| 6828668 | Flexible lead structures and methods of making same | Belgacem Haba | 2004-12-07 |
| 6821815 | Method of assembling a semiconductor chip package | Joseph Fjelstad | 2004-11-23 |
| 6774306 | Microelectronic connections with liquid conductive elements | — | 2004-08-10 |
| 6737265 | Microelectronic unit forming methods and materials | Masud Beroz, Joseph Fjelstad, Belgacem Haba, Christopher M. Pickett | 2004-05-18 |
| 6723584 | Methods of making microelectronic assemblies including compliant interfaces | Zlata Kovac, Craig Mitchell, Thomas H. DiStefano | 2004-04-20 |
| 6707149 | Low cost and compliant microelectronic packages for high i/o and fine pitch | — | 2004-03-16 |
| 6687842 | Off-chip signal routing between multiply-connected on-chip electronic elements via external multiconductor transmission line on a dielectric element | Thomas H. DiStefano | 2004-02-03 |
| 6686015 | Transferable resilient element for packaging of a semiconductor chip and method therefor | Kurt Raab | 2004-02-03 |
| 6675469 | Vapor phase connection techniques | Belgacem Haba | 2004-01-13 |
| D485096 | Partition insert | Thomas Overthun, James N. Ludwig, David M. Gresham, Karl-Heinz Mueller, Monika Conway +1 more | 2004-01-13 |
| 6664621 | Semiconductor chip package with interconnect structure | Belgacem Haba | 2003-12-16 |
| D481226 | Partition insert | Thomas Overthun, James N. Ludwig, David M. Gresham, Karl-Heinz Mueller, Monika Conway +1 more | 2003-10-28 |