Issued Patents All Time
Showing 551–575 of 636 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7268426 | High-frequency chip packages | Michael Warner, Lee Smith, Glenn Urbish, Masud Beroz, Teck-Gyu Kang | 2007-09-11 |
| 7262368 | Connection structures for microelectronic devices and methods for forming such structures | Masud Beroz, David B. Tuckerman, Giles Humpston, Richard Dewitt Crisp | 2007-08-28 |
| 7224056 | Back-face and edge interconnects for lidded package | Robert Burtzlaff, Giles Humpston, David B. Tuckerman, Michael Warner, Craig Mitchell | 2007-05-29 |
| 7202112 | Micro lead frame packages and methods of manufacturing the same | Craig Mitchell | 2007-04-10 |
| 7176043 | Microelectronic packages and methods therefor | Masud Beroz, Ronald Green, Ilyas Mohammed, Stuart E. Wilson, Wael Zohni +2 more | 2007-02-13 |
| 7170314 | Multiple channel modules and bus systems using same | Richard E. Perego, David Nguyen, Billy Wayne Garrett, Jr., Ely Tsern, Crag E. Hampel +1 more | 2007-01-30 |
| 7149095 | Stacked microelectronic assemblies | Michael Warner, Philip Damberg, John Riley, David Gibson, Young Gon Kim +1 more | 2006-12-12 |
| 7114250 | Method of making components with releasable leads | Konstantine Karavakis | 2006-10-03 |
| 7078790 | Semiconductor stacked die devices and methods of forming semiconductor stacked die devices | — | 2006-07-18 |
| 7067742 | Connection component with peelable leads | Thomas H. DiStefano, Joseph Fjelstad, Owais Jamil, Konstantine Karavakis, David Light +1 more | 2006-06-27 |
| 7061121 | Stacked microelectronic assemblies with central contacts | — | 2006-06-13 |
| 7037757 | Stacked semiconductor module | Thomas F. Fox, Sayeh Khalili, David Nguyen, Richard E. Warmke, Xingchao Yuan | 2006-05-02 |
| 7036222 | Method for forming a multi-layer circuit assembly | — | 2006-05-02 |
| 7027307 | Clock routing in multiple channel modules and bus systems | Ravindranath Kollipara, David Nguyen | 2006-04-11 |
| 7012812 | Memory module | — | 2006-03-14 |
| 7012323 | Microelectronic assemblies incorporating inductors | Michael Warner, Masud Beroz | 2006-03-14 |
| 6965158 | Multi-layer substrates and fabrication processes | John W. Smith | 2005-11-15 |
| 6940158 | Assemblies having stacked semiconductor chips and methods of making same | Masud Beroz | 2005-09-06 |
| 6933610 | Method of bonding a semiconductor die without an ESD circuit and a separate ESD circuit to an external lead, and a semiconductor device made thereby | Para K. Segaram, Joseph Fjelstad | 2005-08-23 |
| 6921713 | Semiconductor chip package with interconnect structure | John W. Smith | 2005-07-26 |
| 6902953 | Methods of forming semiconductor stacked die devices | — | 2005-06-07 |
| 6898085 | Multiple channel modules and bus systems using same | Richard E. Perego, David Nguyen, Billy Wayne Garrett, Jr., Ely Tsern, Craig E. Hampel +1 more | 2005-05-24 |
| 6891272 | Multi-path via interconnection structures and methods for manufacturing the same | Joseph Fjelstad | 2005-05-10 |
| 6884120 | Array connector with deflectable coupling structure for mating with other components | Para K. Segaram, Joseph Fjelstad | 2005-04-26 |
| 6870246 | Method and apparatus for providing an integrated circuit cover | Donald R. Mullen, Ming Li | 2005-03-22 |