Issued Patents All Time
Showing 501–525 of 636 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE42429 | Semiconductor module with serial bus connection to multiple dies | — | 2011-06-07 |
| 7952195 | Stacked packages with bridging traces | — | 2011-05-31 |
| 7939934 | Microelectronic packages and methods therefor | David Gibson | 2011-05-10 |
| RE42318 | Semiconductor module with serial bus connection to multiple dies | — | 2011-05-03 |
| 7935568 | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating | Vage Oganesian, David Ovrutsky, Charles Rosenstein, Giles Humpston | 2011-05-03 |
| 7923851 | Microelectronic assembly with impedance controlled wirebond and conductive reference element | Brian Marcucci | 2011-04-12 |
| 7911805 | Multilayer wiring element having pin interface | — | 2011-03-22 |
| 7901989 | Reconstituted wafer level stacking | Ilyas Mohammed, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi | 2011-03-08 |
| 7855623 | Low loss RF transmission lines having a reference conductor with a recess portion opposite a signal conductor | Ronald Green, David W. Wallis, Nicholas Colella | 2010-12-21 |
| 7829438 | Edge connect wafer level stacking | Vage Oganesian | 2010-11-09 |
| 7816251 | Formation of circuitry with modification of feature height | Masud Beroz, Young Gon Kim, David B. Tuckerman | 2010-10-19 |
| 7793414 | Methods for forming connection structures for microelectronic devices | Masud Beroz, David B. Tuckerman, Giles Humpston, Richard Dewitt Crisp | 2010-09-14 |
| 7791199 | Packaged semiconductor chips | Andrey Grinman, David Ovrutsky, Charles Rosenstein, Vage Oganesian | 2010-09-07 |
| 7768117 | Microelectronic package having interconnected redistribution paths | Richard Dewitt Crisp, Masud Beroz | 2010-08-03 |
| 7767497 | Microelectronic package element and method of fabricating thereof | — | 2010-08-03 |
| 7759166 | Microelectronic packages fabricated at the wafer level and methods therefor | Giles Humpston | 2010-07-20 |
| 7759782 | Substrate for a microelectronic package and method of fabricating thereof | Craig Mitchell, Apolinar Alvarez, Jr. | 2010-07-20 |
| 7754537 | Manufacture of mountable capped chips | Yoichi Kubota | 2010-07-13 |
| 7749886 | Microelectronic assemblies having compliancy and methods therefor | Vage Oganesian, Guilian Gao, David Ovrutsky | 2010-07-06 |
| 7745943 | Microelectonic packages and methods therefor | Masud Beroz, Teck-Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John Riley +1 more | 2010-06-29 |
| 7737513 | Chip assembly including package element and integrated circuit chip | Charles White, Michael J. Nystrom | 2010-06-15 |
| 7719121 | Microelectronic packages and methods therefor | Giles Humpston, Guilian Gao | 2010-05-18 |
| 7709297 | Microelectronic package with thermal access | Stuart E. Wilson | 2010-05-04 |
| 7709968 | Micro pin grid array with pin motion isolation | Philip Damberg, David B. Tuckerman, Teck-Gyu Kang | 2010-05-04 |
| 7683468 | Enabling uniformity of stacking process through bumpers | Ilyas Mohammed | 2010-03-23 |