Issued Patents All Time
Showing 526–550 of 636 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7638868 | Microelectronic package | — | 2009-12-29 |
| 7632708 | Microelectronic component with photo-imageable substrate | David B. Tuckerman | 2009-12-15 |
| 7593636 | Pin referenced image sensor to reduce tilt in a camera module | Michael J. Nystrom, David B. Tuckerman, Giles Humpston, Jesse Thompson | 2009-09-22 |
| 7554206 | Microelectronic packages and methods therefor | Masud Beroz, Ronald Green, Ilyas Mohammed, Stuart E. Wilson, Wael Zohni +2 more | 2009-06-30 |
| 7534652 | Microelectronic elements with compliant terminal mountings and methods for making the same | Ilyas Mohammed, Craig Mitchell, Michael Warner, Jesse Thompson | 2009-05-19 |
| 7521276 | Compliant terminal mountings with vented spaces and methods | Michael J. Nystrom, Giles Humpston | 2009-04-21 |
| 7495179 | Components with posts and pads | Yoichi Kubota, Teck-Gyu Kang, Jae M. Park | 2009-02-24 |
| 7462936 | Formation of circuitry with modification of feature height | Masud Beroz, Young Gon Kim, David B. Tuckerman | 2008-12-09 |
| 7462932 | Manufacture of mountable capped chips | Yoichi Kubota | 2008-12-09 |
| 7453157 | Microelectronic packages and methods therefor | Masud Beroz, Teck-Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John Riley +1 more | 2008-11-18 |
| 7453139 | Compliant terminal mountings with vented spaces and methods | Michael J. Nystrom, Giles Humpston | 2008-11-18 |
| 7427423 | Components with conductive solder mask layers | Masud Beroz | 2008-09-23 |
| 7417871 | Memory module | — | 2008-08-26 |
| 7368695 | Image sensor package and fabrication method | Teck-Gyu Kang, Michael Estrella, Jae M. Park, Kenneth R. Thompson, Craig Mitchell | 2008-05-06 |
| 7361979 | Multi-sheet conductive substrates for microelectronic devices and methods for forming such substrates | Masud Beroz | 2008-04-22 |
| 7351641 | Structure and method of forming capped chips | Masud Beroz, Glenn Urbish, David B. Tuckerman | 2008-04-01 |
| 7332068 | Selective removal of dielectric materials and plating process using same | Irina Poukhova, Masud Beroz | 2008-02-19 |
| 7317249 | Microelectronic package having stacked semiconductor devices and a process for its fabrication | Richard Dewitt Crisp, Giles Humpston | 2008-01-08 |
| 7309910 | Micro lead frame packages and methods of manufacturing the same | Craig Mitchell | 2007-12-18 |
| 7307293 | Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths | Joseph Fjelstad, Para K. Segaram | 2007-12-11 |
| 7304376 | Microelectronic assemblies with springs | Jae M. Park, Teck-Gyu Kang, Nicholas Colella | 2007-12-04 |
| 7298030 | Structure and method of making sealed capped chips | Bruce M. McWilliams, Giles Humpston, David B. Tuckerman | 2007-11-20 |
| 7288433 | Method of making assemblies having stacked semiconductor chips | Masud Beroz | 2007-10-30 |
| 7285443 | Stacked semiconductor module | Thomas F. Fox, Sayeh Khalili, David Nguyen, Richard E. Warmke, Xingchao Yuan | 2007-10-23 |
| 7268304 | Microelectronic connection components having bondable wires | Masud Beroz, Jae M. Park, Fion Tan, Philip R. Osborn | 2007-09-11 |