Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE44019 | Stacked semiconductor module | Thomas F. Fox, Belgacem Haba, David Nguyen, Richard E. Warmke, Xingchao Yuan | 2013-02-19 |
| RE43720 | Integrated circuit device having stacked dies and impedance balanced transmission lines | Donald V. Perino | 2012-10-09 |
| 7705445 | Semiconductor package with low and high-speed signal paths | Ming Li, Donald R. Mullen | 2010-04-27 |
| 7285443 | Stacked semiconductor module | Thomas F. Fox, Belgacem Haba, David Nguyen, Richard E. Warmke, Xingchao Yuan | 2007-10-23 |
| 7037757 | Stacked semiconductor module | Thomas F. Fox, Belgacem Haba, David Nguyen, Richard E. Warmke, Xingchao Yuan | 2006-05-02 |
| 6853557 | Multi-channel memory architecture | Belgacem Haba, Donald R. Mullen, Nader Gamini | 2005-02-08 |
| 6720643 | Stacked semiconductor module | Thomas F. Fox, Belgacem Haba, David Nguyen, Richard E. Warmke, Xingchao Yuan | 2004-04-13 |
| 6657871 | Multiple channel modules and bus systems using same | Donald V. Perino, Belgacem Haba | 2003-12-02 |
| 6621155 | Integrated circuit device having stacked dies and impedance balanced transmission lines | Donald V. Perino | 2003-09-16 |
| 6545875 | Multiple channel modules and bus systems using same | Donald V. Perino, Belgacem Haba | 2003-04-08 |
| 6514794 | Redistributed bond pads in stacked integrated circuit die package | Belgacem Haba, Donald V. Perino | 2003-02-04 |
| 6376904 | Redistributed bond pads in stacked integrated circuit die package | Belgacem Haba, Donald V. Perino | 2002-04-23 |