Issued Patents All Time
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9710679 | Anti-data theft structures and electronic devices with the same | — | 2017-07-18 |
| 9700950 | Innovative multi-purpose dipping plate | Bor-Ping Jang, Lin-Wei Wang, Yi-Li Hsiao, Chien Ling Hwang, Chung-Shi Liu | 2017-07-11 |
| 9648765 | Anti-disassembly protection structure | Sheng-Yen Lin | 2017-05-09 |
| 9618945 | Monitoring surface temperature of devices | Andrew Douglas Delano, Timothy Allen Jakoboski | 2017-04-11 |
| 9614307 | Anti-data theft structures and electronic devices with the same | Chih-Hsiang Fan | 2017-04-04 |
| 9560778 | Cover operation mechanism | — | 2017-01-31 |
| 9514335 | Anti-tamper device | — | 2016-12-06 |
| 9449931 | Pillar bumps and process for making same | Cheng-Chung Lin, Chung-Shi Liu, Meng-Wei Chou, Kuo-Cheng Lin, Wen-Hsiung Lu +2 more | 2016-09-20 |
| 9425179 | Chip packages and methods of manufacture thereof | Chien Ling Hwang, Pei-Hsuan Lee, Yeong-Jyh Lin, Chung-Shi Liu | 2016-08-23 |
| 9271410 | Anti-tamper device | Sheng-Yen Lin | 2016-02-23 |
| 9253906 | Cover with an opening structure | — | 2016-02-02 |
| 9219480 | Low tau synchronizer flip-flop with dual loop feedback approach to improve mean time between failure | Hwong-Kwo Lin, Ge Yang, Xi Zhang | 2015-12-22 |
| 9106084 | Electrical charger for charging electronic device | — | 2015-08-11 |
| 9105760 | Pick-and-place tool for packaging process | Chien Ling Hwang, Yi-Li Hsiao | 2015-08-11 |
| 8964120 | Television system and method for managing applications therein | Yi-Wei Huang, Wen-Jin Tien | 2015-02-24 |
| 8823166 | Pillar bumps and process for making same | Cheng-Chung Lin, Chung-Shi Liu, Meng-Wei Chou, Kuo-Cheng Lin, Wen-Hsiung Lu +2 more | 2014-09-02 |
| 8546802 | Pick-and-place tool for packaging process | Chien Ling Hwang, Yi-Li Hsiao | 2013-10-01 |
| 8317077 | Thermal compressive bonding with separate die-attach and reflow processes | Chien Ling Hwang, Cheng-Chung Lin, Chung-Shi Liu | 2012-11-27 |
| 8258055 | Method of forming semiconductor die | Chien Ling Hwang, Zheng-Yi Lim, Yi-Yang Lei, Cheng-Chung Lin, Chung-Shi Liu | 2012-09-04 |
| 8177862 | Thermal compressive bond head | Chien Ling Hwang, Cheng-Chung Lin, Chung-Shi Liu | 2012-05-15 |
| 8104666 | Thermal compressive bonding with separate die-attach and reflow processes | Chien Ling Hwang, Cheng-Chung Lin, Chung-Shi Liu | 2012-01-31 |
| 8088692 | Method for fabricating a multilayer microstructure with balancing residual stress capability | Hwai-Pwu Chou | 2012-01-03 |
| 7433490 | System and method for real time lip synchronization | Stephen S. Lin, Baining Guo, Heung-Yeung Shum | 2008-10-07 |
| 7133535 | System and method for real time lip synchronization | Stephen S. Lin, Baining Guo, Heung-Yeung Shum | 2006-11-07 |