Issued Patents All Time
Showing 101–125 of 157 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164848 | Semiconductor structure and method manufacturing the same | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Tzuan-Horng Liu, Chuan-An Cheng | 2021-11-02 |
| 11114413 | Stacking structure, package structure and method of fabricating the same | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih | 2021-09-07 |
| 11069658 | System on integrated chips and methods of forming same | Chen-Hua Yu, Ming-Fa Chen | 2021-07-20 |
| 11069608 | Semiconductor structure and manufacturing method thereof | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih | 2021-07-20 |
| 11063019 | Package structure, chip structure and method of fabricating the same | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih | 2021-07-13 |
| 11063022 | Package and manufacturing method of reconstructed wafer | Ming-Fa Chen, Chao-Wen Shih, Hsien-Wei Chen, Tzuan-Horng Liu | 2021-07-13 |
| 11056438 | Semiconductor packages and method of forming the same | Ming-Fa Chen, Nien-Fang Wu, Tzuan-Horng Liu, Chao-Wen Shih | 2021-07-06 |
| 11043482 | Semiconductor component, package structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Chi-Hwang Tai | 2021-06-22 |
| 11024605 | Integrated circuit package and method | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih, Nien-Fang Wu | 2021-06-01 |
| 11004826 | 3DIC formation with dies bonded to formed RDLs | Chen-Hua Yu, Ming-Fa Chen | 2021-05-11 |
| 10971443 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen | 2021-04-06 |
| 10886245 | Semiconductor structure, 3DIC structure and method of fabricating the same | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2021-01-05 |
| 10872836 | Package structure for heat dissipation | Chen-Hua Yu, Ming-Fa Chen | 2020-12-22 |
| 10867966 | Package structure, package-on-package structure and method of fabricating the same | Hsien-Wei Chen, Ming-Fa Chen, Chao-Wen Shih | 2020-12-15 |
| 10867879 | Integrated circuit package and method | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2020-12-15 |
| 10867929 | Semiconductor structures and methods of forming the same | Chen-Hua Yu, Tzuan-Horng Liu, Ming-Fa Chen, Chao-Wen Shih | 2020-12-15 |
| 10854574 | Forming metal bonds with recesses | Ming-Fa Chen, Hsien-Wei Chen, Wen-Chih Chiou | 2020-12-01 |
| 10840217 | Stacked chip package and methods of manufacture thereof | Chen-Hua Yu, Ming-Fa Chen | 2020-11-17 |
| 10797015 | Method of manufacturing 3DIC structure | Hsien-Wei Chen, Ming-Fa Chen | 2020-10-06 |
| 10784219 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Ching-Pin Yuan, Sen-Bor Jan, Ming-Fa Chen | 2020-09-22 |
| 10756010 | Semiconductor device packaging structure having through interposer vias and through substrate vias | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2020-08-25 |
| 10685911 | Semiconductor package and manufacturing method of the same | Ming-Fa Chen, Chen-Hua Yu | 2020-06-16 |
| 10685910 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen | 2020-06-16 |
| 10685935 | Forming metal bonds with recesses | Ming-Fa Chen, Hsien-Wei Chen, Wen-Chih Chiou | 2020-06-16 |
| 10672674 | Method of forming semiconductor device package having testing pads on a topmost die | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu, Ching-Pin Yuan | 2020-06-02 |