Issued Patents All Time
Showing 151–157 of 157 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741694 | Semiconductor structure and method of manufacturing the same | Chen-Hua Yu, Ming-Fa Chen | 2017-08-22 |
| 9620488 | Three-dimensional integrated circuit structure and bonded structure | Chen-Hua Yu, Ming-Fa Chen | 2017-04-11 |
| 9548274 | Reticle for non-rectangular die | Chen-Hua Yu, Ming-Fa Chen | 2017-01-17 |
| 9524959 | System on integrated chips and methods of forming same | Chen-Hua Yu, Ming-Fa Chen | 2016-12-20 |
| 9508703 | Stacked dies with wire bonds and method | Chen-Hua Yu, Ming-Fa Chen, Meng-Tse Chen, Hui-Min Huang, Hsiu-Jen Lin +2 more | 2016-11-29 |
| 9331021 | Chip-on-wafer package and method of forming same | Chen-Hua Yu, Ming-Fa Chen | 2016-05-03 |
| 8042445 | Cutting mold for rigid-flexible circuit board and method for forming the same | Yu-Lun Lin, Chih-Ming Lin, Yu-Min Chen | 2011-10-25 |