Issued Patents All Time
Showing 126–150 of 157 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672754 | Semiconductor component, package structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Chi-Hwang Tai | 2020-06-02 |
| 10658333 | Package structure and method of fabricating the same | Hsien-Wei Chen, Ming-Fa Chen | 2020-05-19 |
| 10622327 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Ming-Fa Chen | 2020-04-14 |
| 10541227 | System on integrated chips and methods of forming same | Chen-Hua Yu, Ming-Fa Chen | 2020-01-21 |
| 10535631 | 3D Chip-on-wager-on-substrate structure with via last process | Chen-Hua Yu, Ming-Fa Chen, Wen-Ching Tsai | 2020-01-14 |
| 10510650 | Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate vias | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2019-12-17 |
| 10510718 | Semiconductor structure and manufacturing method thereof | Ming-Fa Chen, Wen-Chih Chiou | 2019-12-17 |
| 10475762 | 3DIC structure and method of manufacturing the same | Hsien-Wei Chen, Ming-Fa Chen | 2019-11-12 |
| 10381298 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen | 2019-08-13 |
| 10319707 | Semiconductor component, package structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Chi-Hwang Tai | 2019-06-11 |
| 10290571 | Packages with si-substrate-free interposer and method forming same | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen | 2019-05-14 |
| 10163799 | Semiconductor structure and method of manufacturing the same | Ming-Fa Chen | 2018-12-25 |
| 10163750 | Package structure for heat dissipation | Chen-Hua Yu, Ming-Fa Chen | 2018-12-25 |
| 10163859 | Structure and formation method for chip package | Chen-Hua Yu, Ming-Fa Chen | 2018-12-25 |
| 10157890 | Semiconductor structure and method of manufacturing the same | Chen-Hua Yu, Ming-Fa Chen | 2018-12-18 |
| 10157882 | 3D chip-on-wafer-on-substrate structure with via last process | Chen-Hua Yu, Ming-Fa Chen, Wen-Ching Tsai | 2018-12-18 |
| 10096571 | Chip-on-wafer package and method of forming same | Chen-Hua Yu, Ming-Fa Chen | 2018-10-09 |
| 10074629 | System on integrated chips and methods of forming same | Chen-Hua Yu, Ming-Fa Chen | 2018-09-11 |
| 10026716 | 3DIC formation with dies bonded to formed RDLs | Chen-Hua Yu, Ming-Fa Chen | 2018-07-17 |
| 10014271 | Semiconductor structure and method of manufacturing the same | Chen-Hua Yu, Ming-Fa Chen | 2018-07-03 |
| 9899355 | Three-dimensional integrated circuit structure | Ching-Pin Yuan, Chen-Hua Yu, Ming-Fa Chen | 2018-02-20 |
| 9875982 | Semiconductor device and manufacturing method thereof | Ming-Fa Chen, Chen-Hua Yu, Ching-Pin Yuan | 2018-01-23 |
| 9859254 | Semiconductor structure and a manufacturing method thereof | Chen-Hua Yu, Ming-Fa Chen | 2018-01-02 |
| 9806055 | Chip-on-wafer package and method of forming same | Chen-Hua Yu, Ming-Fa Chen | 2017-10-31 |
| 9754918 | 3D chip-on-wafer-on-substrate structure with via last process | Chen-Hua Yu, Ming-Fa Chen, Wen-Ching Tsai | 2017-09-05 |