Issued Patents All Time
Showing 51–75 of 157 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854921 | Integrated circuit package and method | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2023-12-26 |
| 11848246 | Integrated circuit package and method | Hsien-Wei Chen, Ming-Fa Chen | 2023-12-19 |
| 11837578 | Package structure | Hsien-Wei Chen, Ming-Fa Chen | 2023-12-05 |
| 11810899 | 3DIC formation with dies bonded to formed RDLs | Chen-Hua Yu, Ming-Fa Chen | 2023-11-07 |
| 11810897 | Package structure and method of fabricating the same | Ming-Fa Chen, Nien-Fang Wu, Tzuan-Horng Liu, Chao-Wen Shih | 2023-11-07 |
| 11784163 | Stacking structure, package structure and method of fabricating the same | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih | 2023-10-10 |
| 11756933 | Inactive structure on SoIC | Ming-Fa Chen, Hsien-Wei Chen | 2023-09-12 |
| 11756907 | Bonding structure and method of forming same | Ming-Fa Chen, Hsien-Wei Chen, Jie Chen | 2023-09-12 |
| 11742297 | Semiconductor packages | Ming-Fa Chen, Nien-Fang Wu, Tzuan-Horng Liu, Chao-Wen Shih | 2023-08-29 |
| 11735544 | Semiconductor packages with stacked dies and methods of forming the same | Ming-Fa Chen, Hsien-Wei Chen, Jie Chen | 2023-08-22 |
| 11728275 | Semiconductor package and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Jie Chen | 2023-08-15 |
| 11721663 | Multi-level stacking of wafers and chips | Ming-Fa Chen, Cheng-Feng Chen, Chuan-An Cheng | 2023-08-08 |
| 11721598 | Method of forming semiconductor device package having testing pads on an upper die | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu, Ching-Pin Yuan | 2023-08-08 |
| 11715723 | Wafer on wafer bonding structure | Ming-Fa Chen, Chao-Wen Shih | 2023-08-01 |
| 11705423 | Package structure | Hsien-Wei Chen, Ming-Fa Chen | 2023-07-18 |
| 11699638 | Package and manufacturing method thereof | Ming-Fa Chen, Jian-Wei Hong | 2023-07-11 |
| 11676942 | Semiconductor structure and method of manufacturing the same | Ming-Fa Chen, Hsien-Wei Chen | 2023-06-13 |
| 11664349 | Stacked chip package and methods of manufacture thereof | Chen-Hua Yu, Ming-Fa Chen | 2023-05-30 |
| 11658150 | System on integrated chips and methods of forming same | Chen-Hua Yu, Ming-Fa Chen | 2023-05-23 |
| 11562983 | Package having multiple chips integrated therein and manufacturing method thereof | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih | 2023-01-24 |
| 11562982 | Integrated circuit packages and methods of forming the same | Chih-Chia Hu, Ming-Fa Chen | 2023-01-24 |
| 11552074 | Package structures and methods of fabricating the same | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih | 2023-01-10 |
| 11527465 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen | 2022-12-13 |
| 11502062 | Integrated circuit package and method | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih, Nien-Fang Wu | 2022-11-15 |
| 11495559 | Integrated circuits | Hsien-Wei Chen, Ming-Fa Chen, Ying-Ju Chen | 2022-11-08 |