Issued Patents All Time
Showing 26–50 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10755978 | Shared contact structure and methods for forming the same | Leo Hsu | 2020-08-25 |
| 10535524 | Tuning threshold voltage through meta stable plasma treatment | Shao-Jyun Wu, Huan-Just Lin | 2020-01-14 |
| 10510600 | Shared contact structure and methods for forming the same | Leo Hsu | 2019-12-17 |
| 10510553 | Dry ashing by secondary excitation | Jack Kuo-Ping Kuo, Chia-Yang Hung, Jyu-Horng Shieh, Shu-Huei Suen, Syun-Ming Jang | 2019-12-17 |
| 7838386 | Method and system for patterning alignment marks on a transparent substrate | Ruei-Hung Jang, Ya-Wen Lee, Tzu-Yang Wu, Chin-Hsiang Lin, Tsai-Sheng Gau | 2010-11-23 |
| 7611960 | Method and system for wafer backside alignment | Sheng-Chieh Liu, Chia-Hung Kao, Tzu-Yang Wu, Yuan-Bang Lee | 2009-11-03 |
| 7450296 | Method and system for patterning alignment marks on a transparent substrate | Ruei-Hung Jang, Ya-Wen Lee, Tzu-Yang Wu, Chin-Hsiang Lin, Tsai-Sheng Gau | 2008-11-11 |
| 7180651 | Spacer fabrication process for manufacturing reflective stealth mirrors and other MEMS devices | Shan-Hua Wu, Fei-Yun Chen, Wei-Ya Wang, Hung-Hsin Liu | 2007-02-20 |
| 7071032 | Material to improve image sensor yield during wafer sawing | Hung-Jen Hsu, Yu-Kung Hsiao, Chih-Kung Chang, Fu-Tien Weng | 2006-07-04 |
| 7009772 | High transmittance overcoat for microlens arrays in semiconductor color imagers | Yu-Kung Hsiao, Bii-Juno Chang, Kuo-Liang Lu | 2006-03-07 |
| 6971270 | Method and apparatus for measuring gripping strength of a vacuum wand | Ruei-Hung Jang, Chih-Lin Ying, Tsung-Chi Hsieh, Ching-Hui Tai | 2005-12-06 |
| 6926818 | Method to enhance the adhesion between dry film and seed metal | Yih-Ann Lin, Tung-Heng Shie, Kai-Ming Ching, Kuo-Liang Lu | 2005-08-09 |
| 6911097 | Photoresist stripper using nitrogen bubbler | Chie-Chi Chen, Wen-Hsiang Tseng, Jen-Shiang Fang | 2005-06-28 |
| 6878642 | Method to improve passivation openings by reflow of photoresist to eliminate tape residue | Hung-Jen Hsu, Yu-Kung Hsiao, Chih-Kung Chang, Kuo-Liang Lu | 2005-04-12 |
| 6849533 | Method for fabricating microelectronic product with attenuated bond pad corrosion | Chih-Kung Chang, Yu-Kung Hsiao, Fu-Tien Wong, Chin-Chen Kuo, Chung-Sheng Hsiung +4 more | 2005-02-01 |
| 6821810 | High transmittance overcoat for optimization of long focal length microlens arrays in semiconductor color imagers | Yu-Kung Hsiao, Bii-Juno Chang, Kuo-Liang Lu | 2004-11-23 |
| 6759276 | Material to improve CMOS image sensor yield during wafer sawing | Hung-Jen Hsu, Yu-Kung Hsiao, Chih-Kung Chang | 2004-07-06 |
| 6712260 | Bump reflow method by inert gas plasma | Wen-Chang Kuo, Chia-Fu Lin, Szu-Yao Wang, Cheng-Yu Chu | 2004-03-30 |
| 6686292 | Plasma etch method for forming uniform linewidth residue free patterned composite silicon containing dielectric layer/silicon stack layer | Szu-Hung Yang | 2004-02-03 |
| 6660641 | Method for forming crack resistant planarizing layer within microelectronic fabrication | Chin-Chen Kuo, Yu-Kung Hsiao, Chih-Kung Chang, Fu-Tien Wong, Chung-Sheng Hsiung | 2003-12-09 |
| 6638688 | Selective electroplating method employing annular edge ring cathode electrode contact | Kai-Ming Ching, Hao-Wei Chang, Chun-Hong Chang, Yen-Ming Chen | 2003-10-28 |
| 6623912 | Method to form the ring shape contact to cathode on wafer edge for electroplating in the bump process when using the negative type dry film photoresist | Kai-Ming Ching, Yu-Kung Hsiao, Kuo-Liang Lu | 2003-09-23 |
| 6586322 | Method of making a bump on a substrate using multiple photoresist layers | Chih-Cheng Chiu, Kuo-Liang Lu | 2003-07-01 |
| 6582988 | Method for forming micro lens structures | Yu-Kung Hsiao, Bii-Junq Chang | 2003-06-24 |
| 6495813 | Multi-microlens design for semiconductor imaging devices to increase light collection efficiency in the color filter process | Yang-Tung Fan, Bii-Cheng Chang, Kuo-Liang Lu | 2002-12-17 |