Issued Patents All Time
Showing 151–169 of 169 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9048128 | Inductor structure with magnetic material | Yuan-Tai Tseng, Chung-Yen Chou, Chia-Shiung Tsai | 2015-06-02 |
| 8999777 | Method of conducting a direction-specific trimming process for contact patterning | Shih-Chang Liu, Chia-Shiung Tsai | 2015-04-07 |
| 8928120 | Wafer edge protection structure | Sheng-De Liu, Chi-Ming Chen, Yuan-Tai Tseng, Chung-Yen Chou, Chia-Shiung Tsai | 2015-01-06 |
| 8629038 | FinFETs with vertical fins and methods for forming the same | — | 2014-01-14 |
| 8629531 | Structure and method to reduce wafer warp for gallium nitride on silicon wafer | Hsieh Ching Pei, Jiun-Lei Jerry Yu, Chi-Ming Chen, Shih-Chang Liu, Chung-Yi Yu +1 more | 2014-01-14 |
| RE44376 | Silicon substrate with reduced surface roughness | Gwo-Yuh Shiau, Tzu-Hsuan Hsu, Chia-Shiung Tsai | 2013-07-16 |
| 8334187 | Hard mask for thin film resistor manufacture | Li-Wen Chang, Der-Chyang Yeh, Chung-Yi Yu, Hsun-Chung Kuang, Hua-Chou Tseng +2 more | 2012-12-18 |
| 8188527 | Embedded capacitor in semiconductor device and method for fabricating the same | Chi-Hsin Lo | 2012-05-29 |
| 8080461 | Method of making a thin film resistor | Der-Chyang Yeh, Hsun-Chung Kuang, Chung-Yi Yu, Chih-Ping Chao, Alexander Kalnitsky | 2011-12-20 |
| 8048807 | Method and apparatus for thinning a substrate | Yao Fei Chuang, Martin Liu, Gwo-Yuh Shiau, Chia-Shiung Tsai | 2011-11-01 |
| 7883926 | Methods for fabricating image sensor devices | Gwo-Yuh Shiau, Yuan-Chih Hsieh, Shih-Chi Fu, Chia-Shiung Tsai | 2011-02-08 |
| 7883917 | Semiconductor device with bonding pad | Yuan-Hung Liu, Gwo-Yuh Shiau, Yuan-Chih Hsieh, Chi-Hsin Lo, Chia-Shiung Tsai | 2011-02-08 |
| 7863067 | Silicon substrate with reduced surface roughness | Gwo-Yuh Shiau, Tzu-Hsuan Hsu, Chia-Shiung Tsai | 2011-01-04 |
| 7824998 | Method of forming a semiconductor capacitor using amorphous carbon | Yuan-Hung Liu, Yeur-Luen Tu, Chi-Hsin Lo, Chia-Shiung Tsai | 2010-11-02 |
| 7732299 | Process for wafer bonding | Fa-Yuan Chang, Tsung-Mu Lai, Kai-Chih Liang, Hua-Shu Wu, Chin-Hsiang Ho +6 more | 2010-06-08 |
| 7709872 | Methods for fabricating image sensor devices | Gwo-Yuh Shiau, Yuan-Chih Hsieh, Shih-Chi Fu, Chia-Shiung Tsai | 2010-05-04 |
| 7691696 | Hemi-spherical structure and method for fabricating the same | Chi-Hsin Lo | 2010-04-06 |
| 7368779 | Hemi-spherical structure and method for fabricating the same | Chi-Hsin Lo | 2008-05-06 |
| 6833233 | Deep UV-resistant photoresist plug for via hole | Chung-Hsiu Cheng, Pin-Yi Hsin, Chih-Hsien Hsu | 2004-12-21 |