Issued Patents All Time
Showing 51–75 of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978412 | Manufacturing method of package structure | Hung-Jui Kuo, Tsao-Lun Chang, Tai-Min Chang | 2021-04-13 |
| 10971442 | Semiconductor device having via sidewall adhesion with encapsulant | Chen-Hua Yu, Yun Chen Hsieh, Hung-Jui Kuo | 2021-04-06 |
| 10964591 | Processes for reducing leakage and improving adhesion | Yun Chen Hsieh, Hung-Jui Kuo, Chen-Hua Yu | 2021-03-30 |
| 10892228 | Method of manufacturing conductive feature and method of manufacturing package | Hung-Jui Kuo, Yun Chen Hsieh | 2021-01-12 |
| 10886231 | Method of forming RDLS and structure formed thereof | Hung-Jui Kuo, Yun Chen Hsieh, Chen-Hua Yu | 2021-01-05 |
| 10879199 | Method of manufacturing semiconductor package | Hung-Jui Kuo, Jyun-Siang Peng | 2020-12-29 |
| 10879161 | Semiconductor packages having a seed layer structure protruding from an edge of metal structure | Hung-Jui Kuo, Jyun-Siang Peng, Chien-Tang Peng | 2020-12-29 |
| 10867827 | Alignment holder, testing apparatus and method for manufacturing a semiconductor package | Chih-Yu Wang, Hung-Jui Kuo | 2020-12-15 |
| 10867874 | Semiconductor device and method | Chen-Hua Yu, Yun Chen Hsieh, Hung-Jui Kuo | 2020-12-15 |
| 10854570 | Integrated fan-out package and method of fabricating the same | Hung-Jui Kuo, Jyun-Siang Peng | 2020-12-01 |
| 10847429 | Method of detecting photoresist scum, method of forming semiconductor package and photoresist scum detection apparatus | Hung-Jui Kuo, Chih-Yu Wang | 2020-11-24 |
| 10840129 | Semiconductor package and method | Hung-Jui Kuo, Yun Chen Hsieh | 2020-11-17 |
| 10707094 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo +1 more | 2020-07-07 |
| 10629540 | Semiconductor device and method | Chen-Hua Yu, Hung-Jui Kuo, Chung-Shi Liu, Han-Ping Pu, Ting-Chu Ko | 2020-04-21 |
| 10622321 | Semiconductor structures and methods of forming the same | Chen-Hua Yu, Hung-Jui Kuo, Tsao-Lun Chang | 2020-04-14 |
| 10522501 | Semiconductor structure and method of forming the same | Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2019-12-31 |
| 10515848 | Semiconductor package and method | Hung-Jui Kuo, Yun Chen Hsieh | 2019-12-24 |
| 10361122 | Processes for reducing leakage and improving adhesion | Yun Chen Hsieh, Hung-Jui Kuo, Chen-Hua Yu | 2019-07-23 |
| 10340206 | Dense redistribution layers in semiconductor packages and methods of forming the same | Chen-Hua Yu, Hung-Jui Kuo | 2019-07-02 |
| 10297551 | Method of manufacturing redistribution circuit structure and method of manufacturing integrated fan-out package | Hung-Jui Kuo, Yun Chen Hsieh | 2019-05-21 |
| 10276402 | Semiconductor package and manufacturing process thereof | Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo +1 more | 2019-04-30 |
| 10186462 | Semiconductor device and method | Chen-Hua Yu, Yun Chen Hsieh, Hung-Jui Kou | 2019-01-22 |
| 9765289 | Cleaning methods and compositions | Hung-Jui Kuo, Chung-Shi Liu | 2017-09-19 |
| 9685372 | Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap | Chien Ling Hwang, Yi-Wen Wu, Chung-Shi Liu | 2017-06-20 |
| 9018758 | Cu pillar bump with non-metal sidewall spacer and metal top cap | Chien Ling Hwang, Yi-Wen Wu, Chung-Shi Liu | 2015-04-28 |