Issued Patents All Time
Showing 51–71 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9679984 | Metal gate structure with multi-layer composition | Hung-Chin Chung, Shiang-Rung Tsai, Cheng-Lung Hung, Hsiao-Kuan Wei | 2017-06-13 |
| 9590065 | Semiconductor device with metal gate structure comprising work-function metal layer and work-fuction adjustment layer | Da-Yuan Lee, Kuan-Ting Liu, Hung-Chin Chung, Weng Chang, Syun-Ming Jang +1 more | 2017-03-07 |
| 9581180 | Clamper and device using the same | Hao-Chung Lien, Yu-Fang Lin | 2017-02-28 |
| 9472638 | FinFETs with multiple threshold voltages | Po-Chin Kuo | 2016-10-18 |
| 9293334 | N metal for FinFET and methods of forming | Po-Chin Kuo, Chung-Liang Cheng, Weng Chang | 2016-03-22 |
| 9123746 | FinFETs with multiple threshold voltages | Po-Chin Kuo | 2015-09-01 |
| 9064857 | N metal for FinFET | Po-Chin Kuo, Chung-Liang Cheng, Weng Chang | 2015-06-23 |
| 8907431 | FinFETs with multiple threshold voltages | Po-Chin Kuo | 2014-12-09 |
| 8759975 | Approach for reducing copper line resistivity | Minghsing Tsai, Syun-Ming Jang | 2014-06-24 |
| 8721346 | Signal transmission module | Yu-Fang Lin, Hao-Chung Lien | 2014-05-13 |
| 8272884 | Signal transmission device | Yu-Fang Lin, Hao-Chung Lien | 2012-09-25 |
| 8242016 | Approach for reducing copper line resistivity | Minghsing Tsai, Syun-Ming Jang | 2012-08-14 |
| 8034709 | Method for forming composite barrier layer | Cheng-Lin Huang, Ching-Hua Hsieh, Shing-Chyang Pan, Chao-Hsien Peng, Li-Lin Su +3 more | 2011-10-11 |
| 7453149 | Composite barrier layer | Cheng-Lin Huang, Ching-Hua Hsieh, Shing-Chyang Pan, Chao-Hsien Peng, Li-Lin Su +3 more | 2008-11-18 |
| 7253501 | High performance metallization cap layer | Jing-Cheng Lin, Shing-Chyang Pan, Ching-Hua Hsieh, Chao-Hsien Peng, Cheng-Lin Huang +2 more | 2007-08-07 |
| 7226860 | Method and apparatus for fabricating metal layer | Jing-Cheng Lin, Shing-Chyang Pan, Ming-Hsing Tsai, Hung-Wen Su, Shih-Wei Chou +3 more | 2007-06-05 |
| 7193327 | Barrier structure for semiconductor devices | Chen-Hua Yu, Shing-Chyang Pan, Shau-Lin Shue, Ching-Hua Hsieh, Cheng-Lin Huang +1 more | 2007-03-20 |
| 7101790 | Method of forming a robust copper interconnect by dilute metal doping | Hung-Wen Su | 2006-09-05 |
| 7091126 | Method for copper surface smoothing | Han-Hsin Kuo, Hung-Wen Su, Wen-Chih Chiou, Tsu Shih | 2006-08-15 |
| 7030023 | Method for simultaneous degas and baking in copper damascene process | Shing-Chyang Pan, Ching-Hua Hsieh, Jing-Cheng Lin, Cheng-Lin Huang, Shau-Lin Shue | 2006-04-18 |
| 6876082 | Refractory metal nitride barrier layer with gradient nitrogen concentration | Shing-Chuang Pan, Chung-Shi Liu, Chen-Hua Yu | 2005-04-05 |