Issued Patents All Time
Showing 51–65 of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9030013 | Interconnect structures comprising flexible buffer layers | Chao-Hsien Peng, Hsin-Yen Huang, Shau-Lin Shue | 2015-05-12 |
| 9006095 | Semiconductor devices and methods of manufacture thereof | Shin-Yi Yang, Ming-Han Lee, Hsien-Chang Wu | 2015-04-14 |
| 8941239 | Copper interconnect structure and method for forming the same | Chen-Hua Yu, Shau-Lin Shue, Ching-Fu Yeh | 2015-01-27 |
| 8916469 | Method of fabricating copper damascene | Chao-Hsien Peng, Chi-Liang Kuo, Shau-Lin Shue | 2014-12-23 |
| 8912041 | Method for forming recess-free interconnect structure | Chao-Hsien Peng, Shau-Lin Shue | 2014-12-16 |
| 8835304 | Method of semiconductor integrated circuit fabrication | Chih Wei Lu, Chung-Ju Lee, Tien-I Bao | 2014-09-16 |
| 8778794 | Interconnection wires of semiconductor devices | Sunil Kumar Singh, Hsin-Chieh Yao, Chung-Ju Lee | 2014-07-15 |
| 8772934 | Aluminum interconnection apparatus | Ching-Fu Yeh | 2014-07-08 |
| 8749060 | Method of semiconductor integrated circuit fabrication | Ming-Han Lee, Tz-Jun Kuo, Chien-Hsin Ho | 2014-06-10 |
| 8735278 | Copper etch scheme for copper interconnect structure | Ming-Han Lee, Hai-Ching Chen, Tien-I Bao, Chi-Lin Teng | 2014-05-27 |
| 8735280 | Method of semiconductor integrated circuit fabrication | Ching-Fu Yeh, Chao-Hsien Peng, Hsien-Chang Wu | 2014-05-27 |
| 8728936 | Copper etching integration scheme | Chih Wei Lu, Chung-Ju Lee, Tien-I Bao | 2014-05-20 |
| 8624396 | Apparatus and method for low contact resistance carbon nanotube interconnect | Hsien-Chang Wu, Shau-Lin Shue | 2014-01-07 |
| 8106512 | Low resistance high reliability contact via and metal line structure for semiconductor device | Ming-Han Lee, Ming-Shih Yeh, Chen-Hua Yu, Shau-Lin Shue | 2012-01-31 |
| 8013445 | Low resistance high reliability contact via and metal line structure for semiconductor device | Ming-Han Lee, Ming-Shih Yeh, Chen-Hua Yu | 2011-09-06 |