Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7642793 | Ultra-fine pitch probe card structure | Hsu Ming Cheng, Frank Hwang | 2010-01-05 |
| 7576435 | Low-cost and ultra-fine integrated circuit packaging technique | — | 2009-08-18 |
| 7565635 | SiP (system in package) design systems and methods | Louis Chaochiuan Liu, Lewis Chu, Mark Shane Peng, Chao-Shun Hsu, Kim Chen | 2009-07-21 |
| 7514775 | Stacked structures and methods of fabricating stacked structures | Tsorng-Dih Yuan, Hsin-Yu Pan, Kim Chen, Mark Shane Peng, Tjandra Winata Karta | 2009-04-07 |
| 7494846 | Design techniques for stacking identical memory dies | Chao-Shun Hsu, Louis Liu, Mark Shane Peng | 2009-02-24 |
| 7427803 | Electromagnetic shielding using through-silicon vias | Chao-Shun Hsu, Mark Shane Peng, Szu-Wei Lu, Tjandra Winata Karta | 2008-09-23 |
| 7112522 | Method to increase bump height and achieve robust bump structure | Pei-Haw Tsao, Chung Yu Wang | 2006-09-26 |
| 6242075 | Planar multilayer ceramic structures with near surface channels | Daniel J. Miller, Hubert A. VanderPlas | 2001-06-05 |
| 5633535 | Spacing control in electronic device assemblies | Timothy V. Harper, John C. Wynbeek, Eric S. Schneider | 1997-05-27 |
| 5399528 | Multi-layer fabrication in integrated circuit systems | Jacques Leibovitz, Maria L. Cobarruviaz, Kenneth D. Scholz | 1995-03-21 |
| 5221421 | Controlled etching process for forming fine-geometry circuit lines on a substrate | Jacques Leibovitz, Daniel J. Miller, Maria L. Cobarruviaz, John P. Scalia, Howard H. Nakano +1 more | 1993-06-22 |
| 5200300 | Methods for forming high density multi-chip carriers | Jacques Leibovitz, Maria L. Cobarruviaz, Kenneth D. Scholz | 1993-04-06 |
| 5162260 | Stacked solid via formation in integrated circuit systems | Jacques Leibovitz, Maria L. Cobarruviaz, Kenneth D. Scholz | 1992-11-10 |
| 5086335 | Tape automated bonding system which facilitate repair | Jacques Leibovitz, Kenneth D. Scholz, V. K. Nagesh | 1992-02-04 |
| 5055425 | Stacked solid via formation in integrated circuit systems | Jacques Leibovitz, Maria L. Cobarruviaz, Kenneth D. Scholz | 1991-10-08 |
| 5029386 | Hierarchical tape automated bonding method | Kim Chen, Jacques Leibovitz, Edith P. Prather | 1991-07-09 |
| 4782381 | Chip carrier | Richard C. Ruby | 1988-11-01 |