Issued Patents All Time
Showing 51–75 of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7871863 | Integrated circuit package system with multiple molding | Zigmund Ramirez Camacho, Jose Alvin Caparas, Arnel Senosa Trasporto | 2011-01-18 |
| 7868471 | Integrated circuit package-in-package system with leads | Zigmund Ramirez Camacho, Arnel Senosa Trasporto, Abelardo Hadap Advincula | 2011-01-11 |
| 7777310 | Integrated circuit package system with integral inner lead and paddle | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Arnel Senosa Trasporto | 2010-08-17 |
| 7759806 | Integrated circuit package system with multiple device units | Lionel Chien Hui Tay, Zigmund Ramirez Camacho, Arnel Senosa Trasporto | 2010-07-20 |
| 7700404 | Large die package structures and fabrication method therefor | Jose Alvin Caparas, Jae Hun Ku | 2010-04-20 |
| 7671463 | Integrated circuit package system with ground ring | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Arnel Senosa Trasporto | 2010-03-02 |
| 7563647 | Integrated circuit package system with interconnect support | Henry Descalzo Bathan, Il Kwon Shim, Zigmund Ramirez Camacho | 2009-07-21 |
| 7554179 | Multi-leadframe semiconductor package and method of manufacture | Il Kwon Shim, Seng Guan Chow, Pandi C. Marimuthu | 2009-06-30 |
| 7545032 | Integrated circuit package system with stiffener | Henry Descalzo Bathan, Antonio B. Dimaano, Jr., Zigmund Ramirez Camacho | 2009-06-09 |
| 7541221 | Integrated circuit package system with leadfinger support | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Arnel Senosa Trasporto | 2009-06-02 |
| 7498665 | Integrated circuit leadless package system | Leocadio Morona Alabin, Il Kwon Shim, Henry Descalzo Bathan | 2009-03-03 |
| 7479692 | Integrated circuit package system with heat sink | Antonio B. Dimaano, Jr., Il Kwon Shim, Henry Descalzo Bathan | 2009-01-20 |
| 7479409 | Integrated circuit package with elevated edge leadframe | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jose Alvin Caparas | 2009-01-20 |
| 7449369 | Integrated circuit package system with multiple molding | Zigmund Ramirez Camacho, Jose Alvin Caparas, Arnel Senosa Trasporto | 2008-11-11 |
| 7443015 | Integrated circuit package system with downset lead | Sheila Marie L. Alvarez, Jose Alvin Caparas, Robinson Quiazon | 2008-10-28 |
| 7420265 | Integrated circuit package system with integrated circuit support | Henry Descalzo Bathan, Il Kwon Shim, Zigmund Ramirez Camacho | 2008-09-02 |
| 7413933 | Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor | Jae Hun Ku, Byung Joon Han | 2008-08-19 |
| 7400049 | Integrated circuit package system with heat sink | Il Kwon Shim, Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2008-07-15 |
| 7365417 | Overhang integrated circuit package system | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Arnel Senosa Trasporto | 2008-04-29 |
| 7339258 | Dual row leadframe and fabrication method | Jose Alvin Caparas, Jae Hun Ku | 2008-03-04 |
| 7298026 | Large die package and method for the fabrication thereof | Il Kwon Shim, Keng Kiat Lau | 2007-11-20 |
| 7274089 | Integrated circuit package system with adhesive restraint | Il Kwon Shim, Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2007-09-25 |
| 7217599 | Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor | Jae Hun Ku, Byung Joon Han | 2007-05-15 |
| 7129569 | Large die package structures and fabrication method therefor | Jose Alvin Caparas, Jae Hun Ku | 2006-10-31 |
| 7060536 | Dual row leadframe and fabrication method | Jose Alvin Caparas, Jae Hun Ku | 2006-06-13 |