JP

Jeffrey D. Punzalan

SC Stats Chippac: 62 patents #16 of 425Top 4%
SS St Assembly Test Services: 8 patents #5 of 63Top 8%
UP Utac Headquarters Pte.: 5 patents #7 of 101Top 7%
📍 Singapore, SG: #32 of 13,971 inventorsTop 1%
Overall (All Time): #24,673 of 4,157,543Top 1%
76
Patents All Time

Issued Patents All Time

Showing 26–50 of 76 patents

Patent #TitleCo-InventorsDate
8362601 Wire-on-lead package system having leadfingers positioned between paddle extensions and method of manufacture thereof Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay 2013-01-29
8278148 Integrated circuit package system with leads separated from a die paddle Jairus Legaspi Pisigan, Lionel Chien Hui Tay, Zigmund Ramirez Camacho 2012-10-02
8207597 Integrated circuit package system with flashless leads Henry Descalzo Bathan, Il Kwon Shim, Zigmund Ramirez Camacho 2012-06-26
8207600 Integrated circuit package system with encapsulating features Henry Descalzo Bathan, Abelardo Hadap Advincula, Jose Alvin Caparas 2012-06-26
8203220 Integrated circuit package system with multiple device units and method for manufacturing thereof Lionel Chien Hui Tay, Zigmund Ramirez Camacho, Arnel Senosa Trasporto 2012-06-19
8203214 Integrated circuit package in package system with adhesiveless package attach Henry Descalzo Bathan, Zigmund Ramirez Camacho, Lionel Chien Hui Tay 2012-06-19
8148825 Integrated circuit package system with leadfinger Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jairus Legaspi Pisigan 2012-04-03
8129827 Integrated circuit package system with package encapsulation having recess Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Abelardo Jr Hadap Advincula 2012-03-06
8120150 Integrated circuit package system with dual connectivity Guruprasad Badakere Govindaiah, Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay 2012-02-21
8120156 Integrated circuit package system with die on base package Zigmund Ramirez Camacho, Henry Descalzo Bathan, Arnel Senosa Trasporto 2012-02-21
8120149 Integrated circuit package system Zigmund Ramirez Camacho, Henry Descalzo Bathan, Arnel Senosa Trasporto 2012-02-21
8062934 Integrated circuit package system with ground bonds Henry Descalzo Bathan, Zigmund Ramirez Camacho 2011-11-22
8039947 Integrated circuit package system with different mold locking features Henry Descalzo Bathan, Zigmund Ramirez Camacho 2011-10-18
8035204 Large die package structures and fabrication method therefor Jose Alvin Caparas, Jae Hun Ku 2011-10-11
8022514 Integrated circuit package system with leadfinger support Henry Descalzo Bathan, Zigmund Ramirez Camacho, Arnel Senosa Trasporto 2011-09-20
8003443 Non-leaded integrated circuit package system with multiple ground sites Byung Tai Do, Henry Descalzo Bathan, Zigmund Ramirez Camacho 2011-08-23
7993939 Integrated circuit package system with laminate base Zigmund Ramirez Camacho, Henry Descalzo Bathan, Arnel Senosa Trasporto 2011-08-09
7977579 Multiple flip-chip integrated circuit package system Henry Descalzo Bathan, Zigmund Ramirez Camacho, Arnel Senosa Trasporto 2011-07-12
7947534 Integrated circuit packaging system including a non-leaded package Henry Descalzo Bathan, Il Kwon Shim, Keng Kiat Lau 2011-05-24
7936053 Integrated circuit package system with lead structures including a dummy tie bar Henry Descalzo Bathan, Il Kwon Shim, Zigmund Ramirez Camacho 2011-05-03
7928540 Integrated circuit package system Il Kwon Shim, Antonio B. Dimaano, Jr., Henry Descalzo Bathan 2011-04-19
7915724 Integrated circuit packaging system with base structure device Jong-Woo Ha, Koo Hong Lee, Soo Won Lee, Juhyun Park, Zigmund Ramirez Camacho +2 more 2011-03-29
7915716 Integrated circuit package system with leadframe array Jairus Legaspi Pisigan, Lionel Chien Hui Tay, Zigmund Ramirez Camacho 2011-03-29
7901996 Integrated circuit package system with interconnection support and method of manufacture thereof Henry Descalzo Bathan, Il Kwon Shim, Zigmund Ramirez Camacho 2011-03-08
7888181 Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Henry Descalzo Bathan 2011-02-15