Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7556987 | Method of fabricating an integrated circuit with etched ring and die paddle | Il Kwon Shim, Sheila Rima C. Magno | 2009-07-07 |
| 7545032 | Integrated circuit package system with stiffener | Henry Descalzo Bathan, Jeffrey D. Punzalan, Zigmund Ramirez Camacho | 2009-06-09 |
| 7541222 | Wire sweep resistant semiconductor package and manufacturing method therefor | Sheila Rima C. Magno, Byung Tai Do, Dennis Guillermo | 2009-06-02 |
| 7482683 | Integrated circuit encapsulation system with vent | Erick Dahilig, Sheila Marie L. Alvarez, Robinson Quiazon, Jose Alvin Caparas | 2009-01-27 |
| 7479692 | Integrated circuit package system with heat sink | Il Kwon Shim, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2009-01-20 |
| 7456496 | Package design and method of manufacture for chip grid array | Tan Kim Hwee, Roman Perez, Kee Kwang Lau, Alex Chew | 2008-11-25 |
| 7385299 | Stackable integrated circuit package system with multiple interconnect interface | Seng Guan Chow, Heap Hoe Kuan, Dioscoro A. Merilo | 2008-06-10 |
| 7141886 | Air pocket resistant semiconductor package | Byung Tai Do, Dennis Guillermo, Sheila Rima C. Magno | 2006-11-28 |
| 6929981 | Package design and method of manufacture for chip grid array | Tan Kim Hwee, Roman Perez, Kee Kwang Lau, Alex Chew | 2005-08-16 |
| 6734039 | Semiconductor chip grid array package design and method of manufacture | Tan Kim Hwee, Roman Perez, Kee Kwang Lau, Alex Chew | 2004-05-11 |
| 6543127 | Coplanarity inspection at the singulation process | Weddie Aquien, John Briar | 2003-04-08 |