KL

Kee Kwang Lau

AP Advanpack Solutions Pte: 4 patents #7 of 37Top 20%
📍 Singapore, SG: #2,281 of 13,971 inventorsTop 20%
Overall (All Time): #1,220,540 of 4,157,543Top 30%
4
Patents All Time

Issued Patents All Time

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
8766438 Package structure Hwee-Seng Jimmy Chew, Chee Kian Ong 2014-07-01
7456496 Package design and method of manufacture for chip grid array Tan Kim Hwee, Roman Perez, Alex Chew, Antonio B. Dimaano, Jr. 2008-11-25
6929981 Package design and method of manufacture for chip grid array Tan Kim Hwee, Roman Perez, Alex Chew, Antonio B. Dimaano, Jr. 2005-08-16
6734039 Semiconductor chip grid array package design and method of manufacture Tan Kim Hwee, Roman Perez, Alex Chew, Antonio B. Dimaano, Jr. 2004-05-11