Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8633528 | Methods and apparatus for increasing memory density using diode layer sharing | Er-Xuan Ping, Roy E. Scheuerlein | 2014-01-21 |
| 8592793 | Electrode diffusions in two-terminal non-volatile memory devices | Xiying Chen, Chuanbin Pan | 2013-11-26 |
| 8569730 | Carbon-based interface layer for a memory device and methods of forming the same | April D. Schricker, Er-Xuan Ping | 2013-10-29 |
| 8557685 | Memory cell that includes a carbon-based memory element and methods of forming the same | — | 2013-10-15 |
| 8551855 | Memory cell that includes a carbon-based reversible resistance switching element compatible with a steering element, and methods of forming the same | Er-Xuan Ping, Xiying Costa | 2013-10-08 |
| 8481396 | Memory cell that includes a carbon-based reversible resistance switching element compatible with a steering element, and methods of forming the same | Er-Xuan Ping, Xiying Costa, Thomas Jongwan Kwon | 2013-07-09 |
| 8470646 | Modulation of resistivity in carbon-based read-writeable materials | Xiying Chen, Er-Xuan Ping | 2013-06-25 |
| 8471360 | Memory cell with carbon switching material having a reduced cross-sectional area and methods for forming the same | Franz Kreupl, Er-Xuan Ping, Jingyan Zhang | 2013-06-25 |
| 8466044 | Memory cell that includes a carbon-based memory element and methods forming the same | — | 2013-06-18 |
| 8467224 | Damascene integration methods for graphitic films in three-dimensional memories and memories formed therefrom | April D. Schricker, Mark Clark, Andy Fu | 2013-06-18 |
| 8445075 | Method to minimize wet etch undercuts and provide pore sealing of extreme low k (k<2.5) dielectrics | Mei-Yee Shek, Li-Qun Xia, Amir Al-Bayati, Derek R. Witty, Hichem M'Saad | 2013-05-21 |
| 8421050 | Electronic devices including carbon nano-tube films having carbon-based liners, and methods of forming the same | Er-Xuan Ping, April D. Schricker, Wipul Pemsiri Jayasekara | 2013-04-16 |
| 8372740 | Methods for increased array feature density | Yung-Tin Chen, Steven J. Radigan | 2013-02-12 |
| 8309415 | Methods and apparatus for increasing memory density using diode layer sharing | Er-Xuan Ping, Roy E. Scheuerlein | 2012-11-13 |
| 8237146 | Memory cell with silicon-containing carbon switching layer and methods for forming the same | Franz Kreupl, Jingyan Zhang | 2012-08-07 |
| 8114765 | Methods for increased array feature density | Yung-Tin Chen, Steven J. Radigan | 2012-02-14 |
| 8093123 | Integration methods for carbon films in two- and three-dimensional memories formed therefrom | Er-Xuan Ping | 2012-01-10 |
| 7964442 | Methods to obtain low k dielectric barrier with superior etch resistivity | Yijun Liu, Li-Qun Xia, Derek R. Witty, Hichem M'Saad | 2011-06-21 |
| 7955981 | Method of making a two-terminal non-volatile memory pillar device with rounded corner | Xiying Chen, Chuanbin Pan | 2011-06-07 |
| 7851384 | Method to mitigate impact of UV and E-beam exposure on semiconductor device film properties by use of a bilayer film | Yijun Liu, Li-Qun Xia, Chad Peterson, Hichem M'Saad | 2010-12-14 |
| 7830698 | Multilevel nonvolatile memory device containing a carbon storage material and methods of making and using same | Xiying Chen, Bing K. Yen, Dat Nguyen, George Samachisa, Tanmay Kumar +1 more | 2010-11-09 |
| 7112541 | In-situ oxide capping after CVD low k deposition | Li-Qun Xia, Derek R. Witty, Hichem M'Saad | 2006-09-26 |