Issued Patents All Time
Showing 26–50 of 174 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D973209 | Wireless probe | Sung Ho Han, Suk Jin Choi, Soon Hyun Ban | 2022-12-20 |
| 11527470 | Film package and method of fabricating package module | Shle-Ge Lee, Youngbae Kim | 2022-12-13 |
| 11509850 | Image sensor chip that feeds back voltage and temperature information, and an image processing system having the same | Sang Hyun Cho, Dae Hwa Paik, Kyoung Min Koh, Min Ho Kwon, Seung Hyun Lim | 2022-11-22 |
| 11508636 | Multi-layer solution based deposition of dielectrics for advanced substrate architectures | Andrew J. Brown, Siddharth K. Alur, Cheng Xu, Amruthavalli Pallavi Alur | 2022-11-22 |
| 11484889 | Electrification device and electrical dust collecting apparatus including the same | Ki Hong Kim, Jae-Ho Kim | 2022-11-01 |
| 11453272 | Photocatalyst device and air conditioner for vehicle having the same | Jae-Ho Kim, Youn Woo Lim, Yong Jun Jee, Gi-Woo Ro, Jun-Seong Ahn | 2022-09-27 |
| 11450471 | Methods to selectively embed magnetic materials in substrate and corresponding structures | Cheng Xu, Kyu Oh Lee, Junnan Zhao, Rahul Jain, Sai Vadlamani +1 more | 2022-09-20 |
| 11443892 | Substrate assembly with encapsulated magnetic feature | Kyu Oh Lee, Rahul Jain, Sai Vadlamani, Cheng Xu, Junnan Zhao +1 more | 2022-09-13 |
| 11417614 | Methods to embed magnetic material as first layer on coreless substrates and corresponding structures | Cheng Xu, Kyu Oh Lee, Junnan Zhao, Rahul Jain, Sai Vadlamani +1 more | 2022-08-16 |
| 11380609 | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | Cheng Xu, Jiwei Sun, Kyu Oh Lee, Yikang Deng, Zhichao Zhang +2 more | 2022-07-05 |
| 11355459 | Embedding magnetic material, in a cored or coreless semiconductor package | Kyu Oh Lee, Sai Vadlamani, Rahul Jain, Junnan Zhao, Cheng Xu +1 more | 2022-06-07 |
| 11322290 | Techniques for an inductor at a first level interface | Cheng Xu, Yikang Deng, Kyu Oh Lee, Srinivas V. Pietambaram, Ying Wang +3 more | 2022-05-03 |
| 11306964 | Refrigerator | Yong Man Seo, Myoung Jin Jang | 2022-04-19 |
| 11287738 | Method for producing decoration sheet having micropattern | Geo-Hyeok Lim, Seung Hun Lee, Han Na Lee | 2022-03-29 |
| 11272619 | Apparatus with embedded fine line space in a cavity, and a method for forming the same | Kristof Darmawikarta, Robert Alan May, Yikang Deng, Maroun D. Moussallem, Amruthavalli Pallavi Alur +2 more | 2022-03-08 |
| 11225127 | Air blower device of air-conditioning system for vehicle having electric dust collector and controlling method thereof | Yong Jun Jee | 2022-01-18 |
| 11217534 | Galvanic corrosion protection for semiconductor packages | Cheng Xu, Junnan Zhao, Kyu Oh Lee | 2022-01-04 |
| 11142922 | Maisonette type apartment house design structure for reducing noise between floors and allowing easy remodeling | Dae Yeung Park | 2021-10-12 |
| 11139264 | Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate | Rahul Jain, Kyu Oh Lee | 2021-10-05 |
| 11036457 | Display device including plurality of modules and control method therefor | Min Jung Kim, Sang-kyun IM, Young-hoon CHO | 2021-06-15 |
| 11031360 | Techniques for an inductor at a second level interface | Cheng Xu, Yikang Deng, Kyu Oh Lee, Srinivas V. Pietambaram, Ying Wang +3 more | 2021-06-08 |
| 11029912 | Display apparatus dividing the display into a plurality of regions and uniform light control method thereof | Young-hoon CHO, Sang-kyun IM | 2021-06-08 |
| 11011552 | Method for manufacturing a display substrate comprising interconnected first and second wirings | Tae Gon Kim | 2021-05-18 |
| 10971492 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Cheng Xu, Rahul Jain, Seo Young Kim, Kyu Oh Lee, Sai Vadlamani +1 more | 2021-04-06 |
| 10867948 | Metal pillar in a film-type seconductor package | Jung Woo Kim, Woon-bae Kim, Bo In NOH, Go-woon Seong | 2020-12-15 |