Issued Patents All Time
Showing 76–95 of 95 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449940 | Methods and structures for processing semiconductor devices using polymeric materials and adhesives | — | 2016-09-20 |
| 9443744 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, James M. Derderian +1 more | 2016-09-13 |
| 9412675 | Interconnect structure with improved conductive properties and associated systems and methods | Wayne H. Huang, James M. Derderian | 2016-08-09 |
| 9362143 | Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages | Yangyang SUN, Michel Koopmans, Josh D. Woodland, Brandon P. Wirz | 2016-06-07 |
| 9337119 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated systems | Sameer S. Vadhavkar, Xiao Li | 2016-05-10 |
| 9318438 | Semiconductor structures comprising at least one through-substrate via filled with conductive materials | Mark Bossler, Christopher J. Gambee, Randall S. Parker | 2016-04-19 |
| 9299663 | Semiconductor devices and methods for backside photo alignment | Brandon P. Wirz, Keith E. Ypma, Christopher J. Gambee, Kevin M. Dowdle, Irina Vasilyeva +2 more | 2016-03-29 |
| 9224715 | Methods of forming semiconductor die assemblies | — | 2015-12-29 |
| 9153520 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li +3 more | 2015-10-06 |
| 9123700 | Integrated circuit constructions having through substrate vias and methods of forming integrated circuit constructions having through substrate vias | Brandon P. Wirz, Yangyang SUN, Josh D. Woodland | 2015-09-01 |
| 9034769 | Methods of selectively removing a substrate material | Mark Bossler, Christopher J. Gambee, Randall S. Parker | 2015-05-19 |
| 9029257 | Semiconductor constructions and methods of planarizing across a plurality of electrically conductive posts | — | 2015-05-12 |
| 8970034 | Semiconductor assemblies and structures | — | 2015-03-03 |
| 8962449 | Methods for processing semiconductor devices | — | 2015-02-24 |
| 8872356 | Semiconductor structures comprising a dielectric material having a curvilinear profile | Don L. Yates, Yangyang SUN | 2014-10-28 |
| 8729590 | Solid state lighting devices having side reflectivity and associated methods of manufacture | Tongbi Jiang | 2014-05-20 |
| 8519516 | Semiconductor constructions | — | 2013-08-27 |
| 8492242 | Dry flux bonding device and method | Owen R. Fay, Xiao Li, Josh D. Woodland, Shijian Luo, Te-Sung Wu | 2013-07-23 |
| 8436386 | Solid state lighting devices having side reflectivity and associated methods of manufacture | Tongbi Jiang | 2013-05-07 |
| 7994249 | Silane coating compositions and methods of use thereof | William J. van Ooij, Karthik Suryanarayanan, Naveen B V Simhadri, Chetan Shivane, Matthew B. Stacy +1 more | 2011-08-09 |