Issued Patents All Time
Showing 276–300 of 303 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7670077 | Rotatable joint and connecting device used for the same | TE-SHENG JAN, YU-TAO CHEN, CHUN-CHE YEN, Zheng-Qiang Song, Bing-Jing Xu +2 more | 2010-03-02 |
| 7626277 | Integrated circuit package with open substrate | Il Kwon Shim, Kwee Lan Tan, Dario S. Filoteo, Jr. | 2009-12-01 |
| 7078788 | Microelectronic substrates with integrated devices | Quat Vu, Steven Towle | 2006-07-18 |
| 7078240 | Reliable adhesion layer interface structure for polymer memory electrode and method of making same | Xiao-Chun Mu | 2006-07-18 |
| 7018853 | Stepped structure for a multi-rank, stacked polymer memory device and method of making same | Xiao-Chun Mu | 2006-03-28 |
| 7008820 | Chip scale package with open substrate | Il Kwon Shim, Kwee Lan Tan, Dario S. Filoteo, Jr. | 2006-03-07 |
| 6979907 | Integrated circuit package | Il Kwon Shim, Guruprasad G. Badakere | 2005-12-27 |
| 6972296 | Carboxylic acid derivatives that inhibit the binding of integrins to their receptors | Ronald J. Biediger, Qi Chen, E. Radford Decker, George W. Holland, Jamal Kassir +4 more | 2005-12-06 |
| 6960479 | Stacked ferroelectric memory device and method of making same | Xiao-Chun Mu | 2005-11-01 |
| 6952017 | Low-voltage and interface damage-free polymer memory device | Xiao-Chun Mu, Mark Isenberger | 2005-10-04 |
| 6858862 | Discrete polymer memory array and method of making same | Xiao-Chun Mu | 2005-02-22 |
| 6855573 | Integrated circuit package and manufacturing method therefor with unique interconnector | Il Kwon Shim, Guruprasad G. Badakere | 2005-02-15 |
| 6825063 | Integrated core microelectronic package | Quat Vu, Qing Ma, Maria V. Henao, Chun Mu | 2004-11-30 |
| 6802445 | Cost effective substrate fabrication for flip-chip packages | Il Kwon Shim, Sheila Marie L. Alvarez | 2004-10-12 |
| 6798003 | Reliable adhesion layer interface structure for polymer memory electrode and method of making same | Xiao-Chun Mu | 2004-09-28 |
| 6774640 | Test coupon pattern design to control multilayer saw singulated plastic ball grid array substrate mis-registration | — | 2004-08-10 |
| 6756620 | Low-voltage and interface damage-free polymer memory device | Xiao-Chun Mu, Mark Isenberger | 2004-06-29 |
| 6737754 | COF packaged semiconductor | Qing Ma, Jin Lee, Chun Mu, Quat Vu, Larry E. Mosley | 2004-05-18 |
| 6734534 | Microelectronic substrate with integrated devices | Quat Vu, Steven Towle | 2004-05-11 |
| 6624457 | Stepped structure for a multi-rank, stacked polymer memory device and method of making same | Xiao-Chun Mu | 2003-09-23 |
| 6586822 | Integrated core microelectronic package | Quat Vu, Qing Ma, Maria V. Henao, Xiao-Chun Mu | 2003-07-01 |
| 6524887 | Embedded recess in polymer memory package and method of making same | Xiao-Chun Mu | 2003-02-25 |
| 6461954 | Method and an apparatus for forming an under bump metallization structure | Xiao-Chun Mu, Sridhar Balakrishnan | 2002-10-08 |
| 6376919 | Circuit edit interconnect structure through the backside of an integrated circuit die | Paul Winer, Adam J. DeGrush, Steven P. Maher | 2002-04-23 |
| 6312830 | Method and an apparatus for forming an under bump metallization structure | Xiao-Chun Mu, Sridhar Balakrishnan | 2001-11-06 |