Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6376919 | Circuit edit interconnect structure through the backside of an integrated circuit die | Jian Li, Paul Winer, Steven P. Maher | 2002-04-23 |
| 6159754 | Method of making a circuit edit interconnect structure through the backside of an integrated circuit die | Jian Li, Paul Winer, Steven P. Maher | 2000-12-12 |