Issued Patents All Time
Showing 301–303 of 303 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6238954 | COF packaged semiconductor | Qing Ma, Jin Lee, Chun Mu, Quat Vu, Larry E. Mosley | 2001-05-29 |
| 6159754 | Method of making a circuit edit interconnect structure through the backside of an integrated circuit die | Paul Winer, Adam J. DeGrush, Steven P. Maher | 2000-12-12 |
| 6154366 | Structures and processes for fabricating moisture resistant chip-on-flex packages | Qing Ma, Chun Mu, Harry Fujimoto, John R. CARRUTHERS, Chuanbin Pan | 2000-11-28 |