Issued Patents All Time
Showing 51–70 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9230933 | Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure | Jaehyun Lee, SeongWon Park, KiYoun Jang | 2016-01-05 |
| 9202715 | Integrated circuit packaging system with connection structure and method of manufacture thereof | YoungChul Kim, Seong Won Park, Ki Youn Jang, Jaehyun Lee, DeokKyung Yang +2 more | 2015-12-01 |
| 9117812 | Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability | Jaehyun Lee, KiYoun Jang, Taewoo Lee | 2015-08-25 |
| 9053953 | Integrated circuit packaging system with underfill and method of manufacture thereof | DaeWook Yang, Sunmi Kim | 2015-06-09 |
| 9030030 | Semiconductor device and method of forming adjacent channel and dam material around die attach area of substrate to control outward flow of underfill material | KiYoun Jang, Joondong Kim | 2015-05-12 |
| 8900921 | Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV | Sun Mi Kim, OhHan Kim | 2014-12-02 |
| 8877567 | Semiconductor device and method of forming uniform height insulating layer over interposer frame as standoff for semiconductor die | Soo Moon Park, Seungwon Kim | 2014-11-04 |
| 8853855 | Integrated circuit packaging system with conductive pillars and molded cavities and method of manufacture thereof | DaeSik Choi, Sooyoung Lee | 2014-10-07 |
| 8816623 | Motor controlling apparatus and method of the same | Mingi Kim, Jongwon Heo | 2014-08-26 |
| 8786076 | Semiconductor device and method of forming a thermally reinforced semiconductor die | OhHan Kim, YongHee Kang | 2014-07-22 |
| 8766587 | Motor controlling apparatus and controlling method of the same | Mingi Kim, Oksun Yu | 2014-07-01 |
| 8723310 | Integrated circuit packaging system having warpage prevention structures | YiSu Park, Joungln Yang, SangMi Park, DaeSik Choi | 2014-05-13 |
| 8642384 | Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability | Jaehyun Lee, KiYoun Jang, Taewoo Lee | 2014-02-04 |
| 8476115 | Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material | DaeSik Choi, Sang Mi Park | 2013-07-02 |
| 8421201 | Integrated circuit packaging system with underfill and methods of manufacture thereof | DaeWook Yang, Sunmi Kim | 2013-04-16 |
| 8399300 | Semiconductor device and method of forming adjacent channel and DAM material around die attach area of substrate to control outward flow of underfill material | KiYoun Jang, Joondong Kim | 2013-03-19 |
| 8264059 | Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield | OhHan Kim, Sunmi Kim | 2012-09-11 |
| 8143096 | Integrated circuit package system flip chip | SooMoon Park | 2012-03-27 |
| 7956449 | Stacked integrated circuit package system | Oh Han Kim | 2011-06-07 |
| 7906371 | Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield | OhHan Kim, Sunmi Kim | 2011-03-15 |