Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735331 | Bonding wire for semiconductor package and semiconductor package including same | Il Woo Park, Mi Hwa Yu, Chang Bun Yoon | 2017-08-15 |
| 8877567 | Semiconductor device and method of forming uniform height insulating layer over interposer frame as standoff for semiconductor die | KyungHoon Lee, Seungwon Kim | 2014-11-04 |