Issued Patents All Time
Showing 26–50 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9451695 | Epoxy resin compound and radiant heat circuit board using the same | Eun Jin Kim, Hae Yeon Kim, Hyun Gyu Park, Yun Ho An, In Hee Cho | 2016-09-20 |
| 9445500 | Epoxy resin composition and printed circuit board using same | Myeong Jeong Kim, Jeungook Park, Sungjin Yun, Jong Heum Yoon | 2016-09-13 |
| 9357630 | Epoxy resin compound and radiant heat circuit board using the same | Sung Bae Moon, Jong Heum Yoon, Hae Yeon Kim, In Hee Cho | 2016-05-31 |
| 9307675 | Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight | Hyun Gyu Park, Eun Jin Kim, Hae Yeon Kim, Yun Ho An, Hyuk Lee +1 more | 2016-04-05 |
| 9282637 | Epoxy resin compound and radiant heat circuit board using the same | Sung Jin YUN, Hyuk Lee, In Hee Cho, Myeong Jeong Kim, Jong Heum Yoon +5 more | 2016-03-08 |
| 9245689 | Multilayer ceramic electronic component and method of manufacturing the same | Seung Ho Lee, Jong Han Kim, Yoon Hee Lee, Min Gon Lee | 2016-01-26 |
| 9202629 | Multilayer ceramic electronic component | Jong Han Kim, Jeong Ryeol Kim, Su Hwan Cho, Jae Yeol Choi | 2015-12-01 |
| 9053857 | Nickel nanoparticle, method of preparing the same, and multilayer ceramic capacitor using the same | Ro Woon Lee, Sung Koo Kang, Yoon Hee Lee, Young-Ho Kim | 2015-06-09 |
| 9040840 | Multilayer ceramic electronic component and mounting board therefor | Eun Sun CHUNG, Dae Bok Oh, Seung Ho Lee | 2015-05-26 |
| 9000071 | Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound | Hae Yeon Kim, Sungbae Moon, Jeungook Park, Sungjin Yun, JongHeum Yoon +3 more | 2015-04-07 |
| 8964354 | Multi-layered ceramic electronic component and method of manufacturing the same | Ye Jun PARK, Jong Han Kim, Yoon Hee Lee | 2015-02-24 |
| 8941973 | Multilayer ceramic electronic component and method of manufacturing the same | Jong Han Kim | 2015-01-27 |
| 8867190 | Multilayer ceramic electronic component having an average surface roughness to provide adhesion strength between a dielectric layer and inner electrode and fabrication method thereof | Jong Han Kim, Hyun Chul Jeong | 2014-10-21 |
| 7107730 | PSSC complex girder | — | 2006-09-19 |
| 6318038 | Apparatus for retensing pre-stress structure | — | 2001-11-20 |
| 5507872 | Contact sensor-based microdispensing tool | Annette B. Antenucci, Michael Berger, Judy E. Lambert, David T. Naugle, Stephen A. O. Olson +3 more | 1996-04-16 |
| 5421507 | Au-Sn transient liquid bonding in high performance laminates | Charles R. Davis, Richard Hsiao, James R. Loomis, Jonathan D. Reid | 1995-06-06 |
| 5340451 | Process for producing a metal organic polymer combination | Leena Paivikki Buchwalter, Stephen L. Buchwalter, Charles R. Davis, Ronald D. Goldblatt, John E. Heidenreich, III +4 more | 1994-08-23 |
| 5337475 | Process for producing ceramic circuit structures having conductive vias | Farid Youssif Aoude, Emanuel I. Cooper, Peter Richard Duncombe, Shaji Farooq, Edward A. Giess +12 more | 1994-08-16 |
| 5300208 | Fabrication of printed circuit boards using conducting polymer | Marie Angelopoulos, Wu-Song Huang, James R. White | 1994-04-05 |
| 5283104 | Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates | Farid Youssif Aoude, Emanuel I. Cooper, Peter Richard Duncombe, Shaji Farooq, Edward A. Giess +12 more | 1994-02-01 |
| 5280414 | Au-Sn transient liquid bonding in high performance laminates | Charles R. Davis, Richard Hsiao, James R. Loomis, Jonathan D. Reid | 1994-01-18 |
| 5232548 | Discrete fabrication of multi-layer thin film, wiring structures | Scott G. Ehrenberg, L. Wynn Herron, Ekkehard F. Miersch, Janet L. Poetzinger | 1993-08-03 |
| 5173392 | Forming a pattern on a substrate | Ekkehard F. Miersch | 1992-12-22 |
| 5122439 | Forming a pattern on a substrate | Ekkehard F. Miersch | 1992-06-16 |