Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10392499 | Inorganic filler, epoxy resin composition including the same and light emitting element including insulating layer using the composition | Jae Man Park, Hyun Gu Im, Jin A GU, Gun Young Gil, Se Woong NA +1 more | 2019-08-27 |
| 10280289 | Epoxy resin composite and printed circuit board comprising insulating layer using the same | Jina Gu, Gun Young Gil, Jae Man Park | 2019-05-07 |
| 10231332 | Inorganic filler and epoxy resin composition including the same | Sanga Ju, Jina Gu, Se Woong NA | 2019-03-12 |
| 9462689 | Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition | Geon Young Kil, Myeong Jeong Kim, Jae Man Park, Jong Heum Yoon, Jeung Ook Park +3 more | 2016-10-04 |
| 9282637 | Epoxy resin compound and radiant heat circuit board using the same | Hyuk Lee, In Hee Cho, Jae Man Park, Myeong Jeong Kim, Jong Heum Yoon +5 more | 2016-03-08 |