Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10392499 | Inorganic filler, epoxy resin composition including the same and light emitting element including insulating layer using the composition | Sung Jin YUN, Jae Man Park, Hyun Gu Im, Jin A GU, Se Woong NA +1 more | 2019-08-27 |
| 10280289 | Epoxy resin composite and printed circuit board comprising insulating layer using the same | Jina Gu, Jae Man Park, Sung Jin YUN | 2019-05-07 |
| 9282637 | Epoxy resin compound and radiant heat circuit board using the same | Sung Jin YUN, Hyuk Lee, In Hee Cho, Jae Man Park, Myeong Jeong Kim +5 more | 2016-03-08 |