Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12156347 | Jig for via-hole processing, via-hole processing device, and via-hole processing method using same | Jee Hee Lim, Hong Ik Kim, Se Woong NA | 2024-11-26 |
| 10868445 | Magnetic sheet and wireless power reception device comprising same | So Yeon Kim, Seok Bae, Sang Won Lee | 2020-12-15 |
| 9974172 | Epoxy resin compound and radiant heat circuit board using the same | Hae Yeon Kim, Sung Bae Moon, Jae Man Park, Jeung Ook Park, In Hee Cho | 2018-05-15 |
| 9468096 | Epoxy resin composition, and printed circuit board using same | Sungjin Yun, Jae Man Park, Young Ju Han | 2016-10-11 |
| 9462689 | Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition | Geon Young Kil, Myeong Jeong Kim, Jae Man Park, Jeung Ook Park, Sung Jin YUN +3 more | 2016-10-04 |
| 9445498 | Epoxy resin composition and printed circuit board | Myeong Jeong Kim | 2016-09-13 |
| 9445499 | Epoxy resin composition, and printed circuit board using same | Myeong Jeong Kim, Jeungook Park, Sungjin Yun | 2016-09-13 |
| 9445500 | Epoxy resin composition and printed circuit board using same | Myeong Jeong Kim, Jae Man Park, Jeungook Park, Sungjin Yun | 2016-09-13 |
| 9357630 | Epoxy resin compound and radiant heat circuit board using the same | Sung Bae Moon, Jae Man Park, Hae Yeon Kim, In Hee Cho | 2016-05-31 |
| 9282637 | Epoxy resin compound and radiant heat circuit board using the same | Sung Jin YUN, Hyuk Lee, In Hee Cho, Jae Man Park, Myeong Jeong Kim +5 more | 2016-03-08 |