Issued Patents All Time
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6841943 | Plasma processor with electrode simultaneously responsive to plural frequencies | Peter Loewenhardt, Albert R. Ellingboe, Andras Kuthi, Andreas Fischer | 2005-01-11 |
| 6804572 | Enhanced process and profile simulator algorithms | David Cooperberg | 2004-10-12 |
| 6776851 | In-situ cleaning of a polymer coated plasma processing chamber | Harmeet Singh, John Daugherty, Saurabh Ullal | 2004-08-17 |
| 6653058 | Methods for reducing profile variation in photoresist trimming | Yosias Melaku | 2003-11-25 |
| 6618638 | Method for scaling processes between different etching chambers and wafer sizes | Stanley C. Siu | 2003-09-09 |
| 6577915 | Applications of a semi-empirical, physically based, profile simulator | David Cooperberg | 2003-06-10 |
| 6489245 | Methods for reducing mask erosion during plasma etching | Jaroslaw W. Winniczek | 2002-12-03 |
| 6344105 | Techniques for improving etch rate uniformity | John Daugherty, Neil Benjamin, Jeff A. Bogart, David Cooperberg, Alan J. Miller +1 more | 2002-02-05 |
| 6316169 | Methods for reducing profile variation in photoresist trimming | Yosias Melaku | 2001-11-13 |
| 6301510 | Method and apparatus to calibrate a semi-empirical process simulator | David Cooperberg, Richard A. Gottscho | 2001-10-09 |
| 6218309 | Method of achieving top rounding and uniform etch depths while etching shallow trench isolation features | Alan J. Miller | 2001-04-17 |
| 6168690 | Methods and apparatus for physical vapor deposition | Russell F. Jewett, Neil Benjamin, Andrew Perry | 2001-01-02 |
| 6151532 | Method and apparatus for predicting plasma-process surface profiles | Maria E. Barone, Richard A. Gottscho | 2000-11-21 |
| 6093332 | Methods for reducing mask erosion during plasma etching | Jaroslaw W. Winniczek | 2000-07-25 |
| 6033585 | Method and apparatus for preventing lightup of gas distribution holes | Thomas E. Wicker, Albert Lamm | 2000-03-07 |
| 5913140 | Method for reduction of plasma charging damage during chemical vapor deposition | Gregory A. Roche, David T. Hodul | 1999-06-15 |