Issued Patents All Time
Showing 26–50 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406535 | Ion injector and lens system for ion beam milling | Thorsten Lill | 2016-08-02 |
| 9129778 | Fluid distribution members and/or assemblies | Armin Huseinovic | 2015-09-08 |
| 9128382 | Plasma mediated ashing processes that include formation of a protective layer before and/or during the plasma mediated ashing process | Orlando Escorcia, Keping Han, Jianan Hou, Shijian Luo, Carlo Waldfried | 2015-09-08 |
| 8071451 | Method of doping semiconductors | — | 2011-12-06 |
| 7888661 | Methods for in situ surface treatment in an ion implantation system | — | 2011-02-15 |
| 7728293 | Structures and methods for measuring beam angle in an ion implanter | Leonard M. Rubin, Walter H. Class | 2010-06-01 |
| 7709814 | Apparatus and process for treating dielectric materials | Carlo Waldfried, Christopher Garmer, Orlando Escorcia, Palani Sakthivel, Alan C. Janos | 2010-05-04 |
| 7704872 | Ultraviolet assisted pore sealing of porous low k dielectric films | Carlo Waldfried, Orlando Escorcia | 2010-04-27 |
| 7678682 | Ultraviolet assisted pore sealing of porous low k dielectric films | Carlo Waldfried, Orlando Escorcia | 2010-03-16 |
| 7629272 | Ultraviolet assisted porogen removal and/or curing processes for forming porous low k dielectrics | Carlo Waldfried, Qingyuan Han, Orlando Escorcia | 2009-12-08 |
| 7473909 | Use of ion induced luminescence (IIL) as feedback control for ion implantation | — | 2009-01-06 |
| 7011868 | Fluorine-free plasma curing process for porous low-k materials | Carlo Waldfried, Qingyuan Han, Orlando Escorcia, Ralph Albano, Atsushi Shiota | 2006-03-14 |
| 6913796 | Plasma curing process for porous low-k materials | Ralph Albano, Cory Bargeron, Jeff Bremmer, Phil Dembowski, Orlando Escorcia +3 more | 2005-07-05 |
| 6897615 | Plasma process and apparatus | Alan C. Janos, David Ferris, Michael G. Ury | 2005-05-24 |
| 6834656 | Plasma process for removing polymer and residues from substrates | Han Qingyuan, Carlo Waldfried, Orlando Escorcia, Gary A. Dahrooge | 2004-12-28 |
| 6803319 | Process for optically erasing charge buildup during fabrication of an integrated circuit | Alan C. Janos, Anthony Sinnot, Kevin Alexander STEWART, Robert Douglas Mohondro | 2004-10-12 |
| 6759098 | Plasma curing of MSQ-based porous low-k film materials | Qingyuan Han, Carlo Waldfried, Orlando Escorcia, Ralph Albano, Jeff Jang +1 more | 2004-07-06 |
| 6759133 | High modulus, low dielectric constant coatings | Kyuha Chung, Qingyuan Han, Youfan Liu, Eric Scott Moyer, Michael John Spaulding | 2004-07-06 |
| 6756085 | Ultraviolet curing processes for advanced low-k materials | Carlo Waldfried, Qingyuan Han, Orlando Escorcia | 2004-06-29 |
| 6734120 | Method of photoresist ash residue removal | Stuart Rounds, John Scott Hallock, Michael W. Owens, Mahmoud Dahimene | 2004-05-11 |
| 6673197 | Chemical plasma cathode | Joel Penelon | 2004-01-06 |
| 6664737 | Dielectric barrier discharge apparatus and process for treating a substrate | Alan C. Janos, Michael B. Colson | 2003-12-16 |
| 6638875 | Oxygen free plasma stripping process | Qingyan Han, Palani Sakthivel, Ricky Ruffin, Mahmoud Dahimene | 2003-10-28 |
| 6630406 | Plasma ashing process | Carlo Waldfried, Orlando Escorcia, Qingyuan Han, Palani Sakthivel | 2003-10-07 |
| 6605484 | Process for optically erasing charge buildup during fabrication of an integrated circuit | Alan C. Janos, Anthony Sinnot, Kevin Alexander STEWART, Robert Douglas Mohondro | 2003-08-12 |