Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374527 | Substrate processing apparatus and method of manufacturing semiconductor device | Takeshi Yasui, Katsunori FUNAKI, Koichiro Harada | 2025-07-29 |
| 12154826 | Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium | Masanori NAKAYAMA, Katsunori FUNAKI, Tatsushi UEDA, Yuichiro TAKESHIMA, Hiroto IGAWA +1 more | 2024-11-26 |
| 12040161 | Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium | Masanori NAKAYAMA, Katsunori FUNAKI, Tatsushi UEDA, Eiko TAKAMI, Yuichiro TAKESHIMA +3 more | 2024-07-16 |
| 11908682 | Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium | Hiroto IGAWA, Masanori NAKAYAMA, Katsunori FUNAKI, Tatsushi UEDA, Eiko TAKAMI +2 more | 2024-02-20 |
| 11869748 | Substrate processing apparatus and method of manufacturing semiconductor device | Takeshi Yasui, Katsunori FUNAKI, Koichiro Harada | 2024-01-09 |
| 11664275 | Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium | Masanori NAKAYAMA, Katsunori FUNAKI, Tatsushi UEDA, Yuichiro TAKESHIMA, Hiroto IGAWA +1 more | 2023-05-30 |
| 11189483 | Method of manufacturing semiconductor device and non-transitory computer-readable recording medium | Yuichiro TAKESHIMA, Masanori NAKAYAMA, Katsunori FUNAKI, Hiroto IGAWA | 2021-11-30 |
| 11081362 | Method of manufacturing semiconductor device, and recording medium | Yuki YAMAKADO, Masanori NAKAYAMA, Katsunori FUNAKI, Tatsushi UEDA, Eiko TAKAMI +2 more | 2021-08-03 |
| 10796900 | Method of manufacturing semiconductor device | Yuichiro TAKESHIMA, Masanori NAKAYAMA, Katsunori FUNAKI, Hiroto IGAWA | 2020-10-06 |
| 10153153 | Method for removing adhering matter and dry etching method | Akiou Kikuchi, Masanori Watari, Kenji Kameda, Shin Hiyama | 2018-12-11 |
| 9974191 | Method of manufacturing semiconductor device, substrate processing apparatus and recording medium | — | 2018-05-15 |
| 9518321 | Atomic layer deposition processing apparatus to reduce heat energy conduction | Mitsuro Tanabe, Yoshihiko YANAGISAWA, Kazuhiro Yuasa, Masanori Sakai | 2016-12-13 |
| 9472424 | Substrate processing apparatus and a method of manufacturing a semiconductor device | Katsuyoshi Hamano, Masayuki Tomita, Teruo Yoshino | 2016-10-18 |
| 9236246 | Substrate processing apparatus and a method of manufacturing a semiconductor device | Katsuyoshi Hamano, Masayuki Tomita, Teruo Yoshino | 2016-01-12 |
| 9147573 | Substrate processing apparatus and method of manufacturing semiconductor device | — | 2015-09-29 |